5SGXEA3K2F40I3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 19456000 340000 1517-BBGA, FCBGA

Quantity 853 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K2F40I3N – Stratix® V GX FPGA, 340,000 logic elements

The 5SGXEA3K2F40I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high level of on-chip integration with approximately 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 user I/Os, making it suitable for complex digital designs that require large logic capacity and significant I/O bandwidth.

Offered in an industrial grade device and a 1517-BBGA FCBGA package for surface-mount applications, this FPGA supports an operating voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core logic capacity  Approximately 340,000 logic elements enable implementation of large-scale FPGA designs and complex custom logic functions.
  • Embedded memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage to support data-intensive processing.
  • High I/O count  696 user I/Os provide dense board-level connectivity for parallel interfaces, wide buses, and multiple peripheral connections.
  • Stratix V GX transceiver capabilities  Stratix V GX devices in the series are documented with transceiver speed grades up to 14.1 Gbps, offering options for high-speed serial links where required by system designs.
  • Power and voltage  Core supply operation specified between 820 mV and 880 mV to match platform power requirements and system power-tree design.
  • Robust thermal range  Industrial operating temperature from −40 °C to 100 °C supports deployment in temperature-challenging environments.
  • Package and mounting  1517-BBGA (1517-FBGA, 40×40) package in a surface-mount form factor for compact board designs and high-density integration.
  • Compliance  RoHS compliant for environmental regulation alignment.

Typical Applications

  • High-speed networking and communications  Large I/O count and documented Stratix V GX transceiver speed grades support implementation of board-level network processing and multi-gigabit link functions.
  • Compute acceleration and DSP  Extensive logic resources and embedded RAM enable FPGA-based acceleration for compute-heavy or signal-processing workloads.
  • Test, measurement and instrumentation  High I/O density and broad temperature range make the device suitable for demanding instrumentation and laboratory equipment.
  • Broadcast and video processing  Large logic capacity and on-chip memory support real-time video pipelines and multi-channel processing tasks.

Unique Advantages

  • High integration density: Approximately 340,000 logic elements and sizable embedded RAM reduce the need for external ASICs or large discrete logic counts.
  • Wide connectivity: 696 I/Os provide flexibility for parallel interfaces, wide data buses, and multiple peripheral connections without immediate external multiplexing.
  • Industrial-grade thermal range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
  • Documented transceiver performance: Stratix V GX series transceiver speed grades are defined in the device datasheet, enabling planning for multi-gigabit serial links when applicable.
  • Surface-mount, high-density package: 1517-BBGA (40×40) package supports compact board layouts and high-pin-count designs.
  • Regulatory alignment: RoHS compliance supports environmentally regulated product development and deployment.

Why Choose 5SGXEA3K2F40I3N?

The 5SGXEA3K2F40I3N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suited for engineers building complex, I/O-intensive systems that require substantial on-chip logic and memory. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of embedded RAM, and 696 I/Os makes it well suited to applications in networking, compute acceleration, and real-time processing where board-level integration and thermal robustness matter.

Design teams can leverage the Stratix V series electrical and switching characteristics documented in the device datasheet to align system-level power, timing, and transceiver requirements with their project goals.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability details for the 5SGXEA3K2F40I3N FPGA.

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