5SGXEA3K3F35C2L

The 5SGXEA3K3F35C2L is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package designed for commercial applications. It delivers a high on-chip logic capacity and substantial embedded memory for complex, reconfigurable digital designs while providing a wide I/O count and low-voltage core operation.

Built for high-density, high-performance digital systems, this device is suitable for designs that require large logic capacity, numerous I/Os, and significant embedded RAM within a surface-mount BGA package.

Key Features

• Core Logic  340,000 logic elements provide substantial programmable logic capacity for complex systems and custom hardware acceleration.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support large buffering, lookup tables, and memory-intensive algorithms.
• I/O Density  432 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Power and Voltage  Core supply voltage range specified at 820 mV to 880 mV for core power budgeting and thermal planning.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly flows.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Implement large-scale logic functions and custom accelerators using 340,000 logic elements and abundant on-chip RAM.
• Multi-channel I/O systems  Use 432 I/O pins to connect numerous peripherals, parallel interfaces, or front-end data feeds.
• Embedded system integration  Integrate substantial programmable logic and memory in a single 1152-BBGA surface-mount package for compact system designs.

Unique Advantages

• High logic capacity: 340,000 logic elements reduce the need for multiple devices when implementing complex designs.
• Significant embedded memory: Approximately 19.46 Mbits of on-chip RAM provides room for large buffers, tables, and data structures without external memory.
• Extensive I/O connectivity: 432 I/O pins simplify integration with multi-channel sensors, interfaces, and daughtercard connections.
• Compact BGA packaging: 1152-BBGA (35×35) package enables high-density board layouts while remaining compatible with surface-mount assembly.
• Commercial temperature grade: Specified 0 °C to 85 °C operating range for mainstream commercial deployments.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose 5SGXEA3K3F35C2L?

The 5SGXEA3K3F35C2L positions itself as a high-density, commercial-grade Stratix V GX FPGA that combines a large logic fabric, substantial embedded RAM, and a high I/O count in a single surface-mount BGA package. It is well suited to engineers and system designers who need to consolidate complex digital functions and memory-intensive logic into a compact form factor.

With clearly specified core voltage, operating temperature range, and RoHS compliance, this device supports predictable integration into commercial systems where on-board reconfigurable logic and significant local memory are required.

Request a quote or submit a procurement inquiry to obtain pricing, lead time, and availability for 5SGXEA3K3F35C2L.