5SGXEA3K3F35C2LN

The 5SGXEA3K3F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a high-density 1152-BBGA (FCBGA) package. This commercial-grade device combines a large logic fabric, substantial on-chip memory, and a high pin-count I/O arrangement to address demanding, memory- and I/O-intensive programmable logic designs.

Designed for surface-mount board integration, the device targets commercial applications that require significant programmable logic capacity and flexible I/O in a compact BGA footprint.

Key Features

• Logic Capacity  Approximately 340,000 logic elements, providing a high-density programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• I/O Count  432 user I/Os to accommodate high pin-count interfaces and multi-channel connectivity.
• Power  Core supply operating range of 820 mV to 880 mV for the FPGA core rails.
• Package & Mounting  1152-BBGA (FCBGA) package—supplier device package 1152-FBGA (35×35); surface-mount mounting type for standard PCB assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Use the device where large logic capacity and significant on-chip RAM are required to consolidate multiple functions into a single FPGA.
• I/O-intensive platforms  Ideal for systems that require a high number of external interfaces thanks to the 432 available I/Os.
• Commercial embedded solutions  Suited for commercial products operating within 0 °C to 85 °C that need a compact BGA package and surface-mount assembly.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable larger designs and greater integration on a single device, reducing board-level complexity.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and complex state machines without external memory.
• Abundant I/O: 432 I/Os allow flexible interfacing to peripherals, multi-channel links, and high-pin-count connectors.
• Compact BGA package: 1152-BBGA (35×35) provides high pin density in a compact footprint suitable for modern PCBs.
• Commercial suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployment.

Why Choose 5SGXEA3K3F35C2LN?

The 5SGXEA3K3F35C2LN combines a large programmable fabric, substantial embedded memory, and a high I/O count within a compact 1152-BBGA surface-mount package. Its commercial-grade rating and defined operating voltage and temperature ranges make it a clear choice for engineers building high-density, memory- and I/O-focused FPGA solutions.

Designers looking to consolidate functionality, reduce board complexity, and leverage a proven Stratix V GX FPGA architecture will find this part suitable for demanding programmable logic tasks in commercial product lines.

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