5SGXEA3K3F35C4G

The 5SGXEA3K3F35C4G is a Stratix® V GX FPGA from Intel, offered in a 1152-BBGA (FCBGA) 35×35 supplier package. This commercial-grade device delivers high logic and on-chip memory capacity with a large I/O count and a low-voltage core operating window.

Designed for high-density, board-level programmable logic in commercial applications, the device combines 340,000 logic elements and approximately 19.456 Mbits of embedded memory with 432 user I/Os to address demanding integration and interface requirements.

Key Features

• Core Density  340,000 logic elements and 128,300 logic blocks provide significant programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, caches, and algorithmic state storage.
• I/O Capacity  432 user I/Os to support wide parallel interfaces, multiple peripherals, and rich board-level connectivity.
• Power and Voltage  Core supply operation specified from 820 mV to 880 mV to match low-voltage power domains and modern regulator rails.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) for compact board integration; surface mount mounting type.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement large-scale custom logic and state machines where extensive fabric and on-chip RAM are required.
• Board-level system integration  Use the high I/O count and compact FBGA package to consolidate functions and reduce external glue logic in commercial systems.
• Data buffering and on-chip storage  Leverage the approximately 19.456 Mbits of embedded memory for buffering, packet staging, or intermediate data storage in throughput-focused designs.
• Low-voltage core designs  Integrate into systems that use low-voltage core rails (0.82–0.88 V) for power-optimized commercial applications.

Unique Advantages

• High programmable capacity: 340,000 logic elements and 128,300 logic blocks enable integration of complex algorithms without extensive external ASIC/MCU support.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence and improves data locality.
• Extensive I/O: 432 I/Os provide flexible connectivity for parallel interfaces, multiple peripherals, and board-level interconnects.
• Compact, production-ready package: 1152-BBGA (1152-FBGA, 35×35) surface-mount package balances density and manufacturability for commercial products.
• Commercial temperature support: Rated for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• Regulatory-friendly: RoHS compliance facilitates use in global commercial electronics supply chains.

Why Choose 5SGXEA3K3F35C4G?

This Stratix V GX FPGA part combines high logic element count, substantial embedded RAM, and a large I/O complement in a compact FCBGA package, making it suitable for commercial designs that require dense programmable logic and extensive board-level interfacing. Its low-voltage core range and RoHS compliance align with modern power and regulatory requirements for commercial products.

Choose this device when your design demands significant on-chip resources and flexible connectivity while maintaining a production-friendly package and commercial operating range.

If you would like pricing, availability, or to request a quote for this part, submit an inquiry or request a quote through your preferred procurement channel.