5SGXEA3K3F35I3G

The 5SGXEA3K3F35I3G is a Stratix V GX family FPGA device designed for high-density, industrial-grade programmable logic implementations. It features 340,000 logic elements and approximately 19.456 Mbits of on-chip RAM, combined with 432 user I/Os to support complex digital designs.

Device-level characteristics include an industrial operating temperature range and a low-voltage core supply. The Stratix V family datasheet lists GX transceiver speed grade options (for example, GX channel—14.1 Gbps in available speed grades), providing context for high-performance I/O capability within the family.

Key Features

• Core Logic 340,000 logic elements for implementing large-scale digital logic and custom architectures.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for data buffering, state storage, and memory-mapped functions.
• I/O Capacity 432 user I/Os to support wide interfaces, parallel buses, and mixed I/O requirements.
• Power and Voltage Core supply specified between 820 mV and 880 mV to match low-voltage FPGA power domains.
• Package and Mounting 1152-BBGA / 1152-FBGA (35×35) FCBGA package in a surface-mount form factor for high pin-count board designs.
• Temperature Grade Industrial grade with an operating range of -40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS status: Compliant.

Unique Advantages

• High integration density: 340,000 logic elements plus on-chip RAM reduce external component needs and enable complex functions to be implemented on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM supports large buffering and stateful processing without extensive external memory.
• Large I/O count: 432 I/Os provide flexibility for interfacing to multiple peripherals, parallel data lanes, or system-level buses.
• Industrial temperature support: Rated for -40 °C to 100 °C operation to address systems that require extended temperature capability.
• Compact, high-pin-count package: 1152-FBGA (35×35) FCBGA in a surface-mount format allows dense routing and connectivity on modern PCBs.
• Low-voltage core operation: 820 mV–880 mV supply allows designers to align the FPGA core with low-voltage system power architectures.

Why Choose 5SGXEA3K3F35I3G?

The 5SGXEA3K3F35I3G targets designs that need substantial logic capacity, large embedded memory, and a high I/O count within an industrial-temperature FPGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of RAM, and 432 I/Os makes it suitable for complex digital signal processing, protocol bridging, or large-scale control logic where on-chip integration reduces BOM and board-level complexity.

As a Stratix V GX family device, it aligns with the series-level transceiver and performance profiles described in the device datasheet, while providing the package, thermal, and electrical characteristics required for robust industrial applications. The device’s RoHS compliance and surface-mount FCBGA packaging support modern assembly and regulatory needs.

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