5SGXEA3K3F35I3L

The 5SGXEA3K3F35I3L is a Stratix V GX field-programmable gate array (FPGA) IC offered in an industrial temperature grade. It provides a high-density programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory, intended for designs that require large on-chip logic and memory resources.

With 432 user I/Os, a low-voltage core supply range (820 mV to 880 mV), and an FCBGA package (1152-BBGA / 1152-FBGA), this device targets systems that need extensive I/O, compact board-level integration, and operation across extended temperature ranges.

Key Features

• Core Logic  340,000 logic elements (cells) provide high-density programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state machines, and logic-local storage requirements.
• I/O Density  432 user I/Os enable broad external connectivity for multi-channel interfaces and large peripheral sets.
• Power  Core voltage supply specified between 820 mV and 880 mV for defined low-voltage core operation.
• Package & Mounting  Surface-mount FCBGA package listed as 1152-BBGA (supplier device package: 1152-FBGA (35x35)) for high-pin-count, board-level integration.
• Thermal & Grade  Industrial temperature grade with an operating range of −40°C to 100°C for applications requiring extended temperature operation.
• Compliance  RoHS-compliant to meet common material and environmental requirements.

Typical Applications

• High-density programmable systems  Use the device where large logic capacity and embedded memory are required to implement complex custom logic and protocol handling.
• Multi-I/O interface controllers  Leverage 432 I/Os for designs that require extensive peripheral connectivity or numerous channel interfaces.
• Industrial equipment  Industrial-grade temperature operation makes this FPGA suitable for control and automation systems operating across extended temperature ranges.
• Communications and networking  Stratix V GX family device characteristics in the datasheet support transceiver-grade use; the device’s logic density and I/O complement high-bandwidth interface implementations.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing component count and board complexity.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Extensive I/O capability: 432 user I/Os provide the flexibility to connect numerous peripherals, channels, or high-pin-count interfaces without external IO expanders.
• Industrial temperature operation: Rated from −40°C to 100°C for reliable performance in extended-temperature environments.
• Low-voltage core operation: Core supply specified between 820 mV and 880 mV supports designs optimized for defined low-voltage FPGA cores.
• High pin-count FCBGA package: 1152-ball FCBGA (1152-BBGA / 1152-FBGA) delivers the pin density required for complex, high-performance designs in a compact footprint.

Why Choose 5SGXEA3K3F35I3L?

The 5SGXEA3K3F35I3L combines high logic capacity, substantial on-chip memory, and broad I/O resources in an industrial-grade Stratix V GX FPGA package. It is well suited for designs that demand consolidated programmable logic, significant embedded RAM, and numerous external interfaces while operating across an extended temperature range.

For engineering teams targeting robust, high-density FPGA implementations, this device delivers a balance of integration and defined electrical specifications—making it a compelling option for complex digital designs requiring industrial temperature performance and high I/O counts.

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