5SGXEA3K3F35C4N

The 5SGXEA3K3F35C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a large logic fabric and substantial on-chip memory to support complex, programmable digital designs.

Key capabilities exposed in the device data include approximately 19.456 Mbits of embedded memory, 340,000 logic elements, 432 I/Os, a 1152-FBGA (35×35) package, and a commercial operating temperature range of 0 °C to 85 °C. The device operates with a core supply in the range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Logic Capacity — 340,000 logic elements to implement large, complex FPGA designs and custom logic functions.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, queues, and data processing functions.
• I/O Density — 432 I/O pins to support numerous board-level interfaces and high pin-count connectivity.
• Package & Mounting — 1152-FBGA (35×35) supplier device package; surface-mount mounting type for high-pin-count PCB layouts.
• Power — Core supply voltage range of 820 mV to 880 mV to fit designs with low-voltage core domains.
• Temperature & Grade — Commercial grade operation specified from 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Stratix V GX Family Characteristics — Device falls within the Stratix V series and shares the family’s documented electrical and switching characteristics as described in the Stratix V device datasheet.

Typical Applications

• Large-scale programmable logic — Use the high logic element count and on-chip RAM for complex state machines, data processing pipelines, and custom accelerators.
• High-density I/O systems — Leverage 432 I/Os for multi-channel interfaces, wide parallel busses, and dense board connectivity.
• High-speed serial integration — As a Stratix V GX device, it aligns with family-level transceiver capabilities documented in the datasheet for high-speed serial channel implementations.

Unique Advantages

• Substantial logic resources: 340,000 logic elements enable implementation of large, multi-function designs on a single device, reducing the need for multiple FPGAs.
• Significant embedded memory: Approximately 19.456 Mbits of RAM provides local buffering and memory for high-throughput signal processing and packet handling.
• High I/O count: 432 I/Os allow flexible connectivity to peripherals, transceivers, and multiple external devices without extensive board-level multiplexing.
• Compact high-pin-count package: 1152-FBGA (35×35) supports dense routing and integration on compact PCBs while remaining surface-mount compatible.
• Low-voltage core operation: 820 mV to 880 mV core supply range supports designs optimized for low-voltage power domains.
• Documented family-level specifications: Backed by Stratix V family datasheet content for electrical and switching characteristics to aid system-level design and validation.

Why Choose 5SGXEA3K3F35C4N?

The 5SGXEA3K3F35C4N positions itself as a high-capacity Stratix V GX FPGA for designs that require extensive logic resources, abundant embedded RAM, and a large number of I/Os in a single surface-mount FBGA package. Its documented electrical characteristics and family-level transceiver information provide engineers with the data needed to evaluate system-level performance and integration.

This device is suitable for developers and teams building complex programmable logic solutions that prioritize on-chip memory, high I/O count, and a compact, high-pin-count package within commercial temperature ranges.

Request a quote or submit an inquiry to get pricing and availability for 5SGXEA3K3F35C4N and to discuss how it can fit into your next FPGA-based design.