5SGXEA3K3F35C2N

The 5SGXEA3K3F35C2N is a Stratix® V GX field programmable gate array (FPGA) from Intel, provided in a 1152-BBGA (FCBGA) package. It delivers high logic density and substantial on-chip memory to address complex, memory- and logic-intensive FPGA designs.

Engineered for commercial temperature operation, this device is suitable for designs that require a large number of logic elements, significant embedded memory, and a high count of I/O pins within a surface-mount, high-density BGA package.

Key Features

• Core Logic  Approximately 340,000 logic elements to implement complex digital functions and large-scale logic designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Capacity  432 user I/O pins to support wide parallel interfaces and flexible board-level connectivity.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35x35). Surface-mount mounting type for compact board implementations.
• Operating Grade & Temperature  Commercial grade with specified operating temperature from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for regulatory and environmental considerations.
• Stratix V GX Family Characteristics  This part belongs to the Stratix V GX device family as described in the device datasheet, which provides family-level electrical and switching characteristics and documented transceiver speed grades.

Typical Applications

• High-density digital processing  Use the large logic-element count and embedded RAM for signal processing algorithms and compute-intensive logic.
• Protocol bridging and offload  High I/O count enables wide parallel interfaces for protocol conversion, packet processing, and offload functions.
• Memory-centric FPGA functions  On-chip RAM provides local buffering and LUT-based storage for state machines, buffers, and lookup tables.

Unique Advantages

• Highly integrated logic and memory: Combines approximately 340,000 logic elements with ~19.456 Mbits of embedded RAM to reduce the need for external components.
• Extensive I/O: 432 I/Os accommodate complex board-level interconnects and parallel interfaces without immediate external multiplexing.
• Low-voltage core operation: Operates from 870 mV to 930 mV core supply, enabling integration into low-voltage power domains.
• Compact, surface-mount BGA package: 1152-BBGA (1152-FBGA, 35x35) packaging provides a high pin-density footprint for space-constrained PCBs.
• Commercial temperature support: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern assemblies.

Why Choose 5SGXEA3K3F35C2N?

The 5SGXEA3K3F35C2N positions itself for designs that demand a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact surface-mount BGA. Its Stratix V GX family heritage and documented device electrical characteristics make it suitable for developers focused on dense logic implementations and memory-heavy FPGA tasks within commercial temperature ranges.

This device is appropriate for engineering teams and procurement looking for a high-density FPGA solution that balances on-chip memory, logic resources, and I/O in a single package while meeting RoHS environmental requirements.

If you would like pricing, lead-time information, or to request a quote for the 5SGXEA3K3F35C2N, please submit a quote request or contact our sales channel to initiate procurement.