5SGXEA3K3F35C3G

The 5SGXEA3K3F35C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA (FCBGA) package. It is a commercial-grade FPGA optimized for designs that require large logic capacity, ample embedded memory, and a high count of I/O.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 432 I/Os, this device targets high-density logic integration and rich I/O connectivity while operating within a commercial temperature range and a low-voltage core supply window.

Key Features

• Logic Capacity  The device provides 340,000 logic elements to support complex digital designs and high-density implementation.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive processing.
• I/O Resources  432 general-purpose I/O pins to enable broad peripheral connectivity and multi-channel interfacing.
• Core Supply  Operates on a low-voltage core supply range of 820 mV to 880 mV, suitable for power-optimized FPGA designs.
• Package and Mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package supports standard PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, aligned to commercial-grade system requirements.
• Compliance  RoHS compliant to meet environmental directive requirements.

Typical Applications

• High-speed communications and networking  Built on the Stratix V GX family architecture, this device supports designs that leverage high-density logic and extensive I/O for packet processing and protocol bridging.
• Compute acceleration and custom processing  Large logic resources and substantial on-chip RAM enable implementation of custom accelerators and data-path pipelines.
• High-density I/O systems  The 432 I/Os allow integration of multiple interfaces and boards in applications that require broad peripheral and sensor connectivity.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering component count.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports buffering and stateful processing without external memory dependencies.
• Broad I/O capability: 432 I/Os enable flexible system partitioning and direct attachment of numerous peripherals or multi-lane interfaces.
• Compact FCBGA package: The 1152-BBGA (35×35) footprint provides a high-pin-count solution in a compact form factor for dense system boards.
• Commercial-grade operating range: Rated 0 °C to 85 °C for applications and environments that conform to commercial temperature requirements.
• Regulatory readiness: RoHS compliance supports environmental and regulatory needs for modern electronics production.

Why Choose 5SGXEA3K3F35C3G?

The 5SGXEA3K3F35C3G delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it well suited for complex commercial FPGA designs that require dense integration. Its low-voltage core operation and commercial temperature rating provide a defined electrical and thermal envelope for system-level power and thermal planning.

Designed as part of the Stratix V GX family, this device is appropriate for customers building high-density digital logic, memory-heavy data paths, and multi-interface systems that benefit from a single-device implementation and the consistency of vendor-supplied device documentation and support.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA3K3F35C3G and to discuss how it fits your next design.