5SGXEA3K3F35C3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 262 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K3F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA), 340,000 logic elements

The 5SGXEA3K3F35C3N is a Stratix V GX field-programmable gate array (FPGA) in a 1152-BBGA FCBGA package, offered as a commercial-temperature-grade device. It delivers high logic capacity and on-chip memory for complex programmable digital designs.

Key device attributes include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 432 I/O, and a low-voltage core range of 820 mV to 880 mV. The device is RoHS compliant and specified for surface-mount assembly in a 1152-FBGA (35×35) supplier package.

Key Features

  • Core Logic Capacity  340,000 logic elements for implementing large-scale digital logic and custom processing blocks.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFO, and embedded data storage needs.
  • I/O Resources  432 I/O pins to enable extensive external connectivity and flexible board-level interfacing.
  • Power and Supply  Core voltage supply specified between 820 mV and 880 mV to support the device’s power architecture.
  • Package and Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting type for compact PCB integration.
  • Operating Range and Grade  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for adherence to common environmental standards in electronics manufacturing.

Unique Advantages

  • High-density programmable logic: 340,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
  • Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory supports data-intensive functions without immediate external memory dependencies.
  • Ample I/O availability: 432 I/O provide flexibility for multi-channel interfaces, large peripheral sets, or extensive signal routing.
  • Compact surface-mount package: 1152-FBGA (35×35) packaging enables dense PCB layouts while maintaining high pin count.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
  • RoHS compliant: Meets common environmental requirements for electronic assembly and distribution.

Why Choose 5SGXEA3K3F35C3N?

The 5SGXEA3K3F35C3N positions itself as a high-capacity Stratix V GX FPGA option for commercial designs that demand large logic arrays, substantial embedded memory, and a high number of I/O. Its FCBGA surface-mount package and RoHS compliance make it suitable for compact, modern PCB assemblies while operating across a standard commercial temperature range.

Choose this device when your design requires consolidated programmable logic and on-chip memory to reduce BOM complexity and support dense I/O requirements. The device’s documented electrical and operating parameters provide a clear basis for integration into demanding digital systems where Stratix V GX family characteristics are needed.

Request a quote or submit a pricing inquiry for 5SGXEA3K3F35C3N to receive availability and purchasing information.

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