5SGXEA3K3F35C2G

The 5SGXEA3K3F35C2G is a Stratix V GX field programmable gate array (FPGA) offered in a 1152‑BBGA FCBGA package. It combines high logic capacity, embedded memory, and a large I/O count in a surface‑mount package targeted at commercial temperature‑grade designs.

Built for applications that require substantial on‑chip logic and memory resources, this device provides a combination of 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 432 I/O pins to support complex digital integration while operating from a low core supply range.

Key Features

• Logic Capacity  340,000 logic elements to implement large combinational and sequential designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and local storage.
• I/O Density  432 general‑purpose I/O pins to support high interface count and broad connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA (35×35); surface‑mount mounting for compact board integration.
• Power  Core supply range 870 mV to 930 mV to support low‑voltage operation.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental compatibility in commercial systems.
• Documentation  Datasheet coverage includes electrical and switching characteristics, transceiver specifications, and I/O timing for design and validation.

Unique Advantages

• High integration density: 340,000 logic elements enable consolidation of complex subsystems into a single device, reducing board-level component count.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM provides local storage for data paths and buffering, minimizing external memory dependence.
• Broad I/O capability: 432 I/O pins support multiple interfaces and parallel data paths for demanding connectivity requirements.
• Compact surface‑mount package: 1152‑BBGA FCBGA in a 35×35 footprint supports high‑density PCB layouts and reliable soldered mounting.
• Low‑voltage core operation: 870–930 mV supply enables integration into low‑voltage power domains common in modern systems.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match standard commercial electronics environments.

Why Choose 5SGXEA3K3F35C2G?

The 5SGXEA3K3F35C2G is positioned for designers who need high logic density, substantial embedded memory, and extensive I/O in a single commercial‑grade FPGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 432 I/O pins supports consolidation of complex digital functions while simplifying board design.

With a surface‑mount 1152‑BBGA package, low core voltage range, and RoHS compliance, this Stratix V GX device offers a durable, integrable option for commercial electronic systems that require robust on‑chip resources and clear electrical characterization provided in the device datasheet.

Please request a quote or submit your specifications to receive pricing and availability for the 5SGXEA3K3F35C2G Stratix V GX FPGA. Our team can provide part availability and additional technical documentation to support your design evaluation.