5SGXEA3K2F40I3LN

The 5SGXEA3K2F40I3LN is an Intel Stratix V GX field programmable gate array supplied in a 1517-BBGA (1517-FBGA, 40×40) package for surface-mount applications. This industrial-grade FPGA provides large programmable logic capacity, significant on-chip RAM, and extensive I/O to address designs that require high integration and robust operating range.

Key on-device resources include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 I/Os. The device operates over an extended temperature range of –40°C to 100°C and a core voltage range of 820 mV to 880 mV, making it suitable for demanding industrial environments.

Key Features

• Logic Capacity  340,000 logic elements (LEs) to implement large programmable logic designs and complex finite-state machines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and temporary data storage without relying solely on external memory.
• High I/O Count  696 programmable I/O pins providing broad system interfacing capability for parallel buses, control signals, and external peripherals.
• Industrial Temperature Grade  Rated for –40°C to 100°C operation to meet extended-temperature system requirements.
• Power Domain  Core supply between 820 mV and 880 mV to align with modern low-voltage system architectures.
• Package and Mounting  1517-BBGA (1517-FBGA, 40×40) ball-grid array package for high-density PCB routing; surface-mount implementation.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Stratix V GX Series Characteristics  Part of the Stratix V family, which includes GX devices with transceiver speed grade options as described in the series datasheet.

Typical Applications

• High-density logic implementation  Use the large logic element count to consolidate complex digital functions into a single programmable device.
• Memory-intensive datapaths  Leverage approximately 19.456 Mbits of embedded RAM for on-chip buffering and temporary storage in streaming or packet-processing designs.
• I/O-rich system interfaces  The 696 I/Os enable broad connectivity for multi-channel front-ends, parallel sensors, and large control buses.
• Industrial equipment  Designed for systems that require extended temperature operation and reliable surface-mount packaging.

Unique Advantages

• Highly integrated resource set: Combining 340,000 logic elements with approximately 19.456 Mbits of RAM reduces the need for multiple discrete devices and simplifies board-level designs.
• Extensive external interfacing: 696 I/Os provide flexibility to connect numerous peripherals and interfaces without external multiplexing.
• Industrial-temperature robustness: Specified operation from –40°C to 100°C supports deployment in thermally challenging environments.
• Compact, high-density package: The 1517-FBGA (40×40) package enables dense routing and compact PCB layouts for space-constrained systems.
• Low-voltage core compatibility: 820 mV–880 mV supply range aligns with modern power domains, enabling efficient integration into low-voltage designs.
• Environmental compliance: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose 5SGXEA3K2F40I3LN?

The 5SGXEA3K2F40I3LN delivers a balance of large programmable logic capacity, substantial embedded RAM, and a high I/O count in an industrial-grade Stratix V GX device. Its package and electrical characteristics make it well suited to designs that require dense integration, extensive interfacing, and operation across an extended temperature range.

This part is appropriate for engineering teams and procurement seeking a high-capacity FPGA platform that consolidates complex logic and memory-intensive functions while maintaining industrial operating tolerances and RoHS compliance.

If you would like pricing, availability, or a formal quote for the 5SGXEA3K2F40I3LN, please request a quote or submit an inquiry to receive further assistance and lead-time information.