5SGXEA3K2F40I3L

The 5SGXEA3K2F40I3L is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount assembly. This industrial-grade device integrates a high-density logic fabric, substantial on-chip memory, and a large I/O count to address demanding digital-design requirements.

Designed for applications that require high logic capacity and robust operating range, this Stratix V GX device provides a combination of density, I/O resources, and industrial temperature capability for complex signal processing, control, and high-throughput designs.

Key Features

• High Logic Capacity — 340,000 logic elements to implement complex logic, DSP pipelines, and custom accelerators.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and large on-chip data storage.
• Large I/O Count — 696 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C for reliable use in industrial environments.
• Power and Core Voltage — Core voltage supply range of 820 mV to 880 mV to match system power-rail design constraints.
• Package and Mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount FCBGA format for compact, high-density PCB layouts.
• Series-Level Transceiver Options — As part of the Stratix V GX family, the series offers transceiver speed grades up to 14.1 Gbps (series-level information provided in the Stratix V datasheet).
• Regulatory Compliance — RoHS-compliant to support environmentally conscious manufacturing processes.

Typical Applications

• High-performance signal processing — Use the large logic element count and embedded RAM to implement DSP engines, filtering, and real-time data pipelines.
• Multi-channel I/O and interfacing — Leverage 696 I/Os for wide parallel buses, multi-lane interfaces, and aggregating multiple sensor or ADC channels.
• Industrial control and automation — Industrial temperature rating (−40°C to 100°C) and robust packaging make this device suitable for factory automation and control systems.
• Prototyping complex SoC functions — High logic density and on-chip memory support emulation of complex subsystems and rapid design iteration.

Unique Advantages

• High integration density: 340,000 logic elements reduce external glue logic and enable larger functions to be implemented on a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM minimizes external memory dependence and improves deterministic data handling.
• Extensive I/O footprint: 696 I/Os allow flexible partitioning of signals and high channel counts without sacrificing board-level routing options.
• Industrial robustness: Specified for −40°C to 100°C operation to meet the thermal demands of industrial deployments.
• Compact, manufacturable package: 1517-BBGA FCBGA surface-mount package supports high-density PCB designs while remaining compatible with standard assembly processes.
• Environmentally compliant: RoHS status indicates compliance with common environmental mandates for electronic components.

Why Choose 5SGXEA3K2F40I3L?

The 5SGXEA3K2F40I3L combines high logic capacity, significant embedded memory, and a wide I/O complement in an industrial-grade Stratix V GX FPGA. It is positioned for engineering teams that need to consolidate complex logic and high-throughput data paths into a single, surface-mount device while meeting industrial temperature requirements.

As a member of the Stratix V family, this device benefits from series-level engineering documentation covering electrical and switching characteristics, enabling informed power and timing design choices and long-term design scalability within the Stratix V product line.

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