5SGXEA3K2F40I2LN

The 5SGXEA3K2F40I2LN is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in an industrial temperature grade and supplied in a 1517-BBGA FCBGA package. It provides high logic density, substantial embedded memory, and a large I/O count for complex programmable-logic designs.

This device targets designs requiring large-scale programmable logic, significant on-chip RAM, and extensive I/O connectivity while operating across an industrial temperature range. Electrical and switching characteristics for the Stratix V family, including transceiver speed-grade information, are described in the device datasheet.

Key Features

• Core & Logic Capacity  Approximately 340,000 logic elements distributed across 128,300 LABs (logic array blocks), enabling high-density programmable logic implementation.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, LUT memory and packet/data storage.
• I/O Density  Up to 696 I/O pins to support complex board-level interfacing and parallel connectivity.
• High-Speed Transceivers  Stratix V GX family devices include GX transceiver speed grades; datasheet tables list GX channel options up to 14.1 Gbps for high-speed serial links.
• Power and Core Voltage  Core voltage supply range from 820 mV to 880 mV to match device power requirements.
• Package & Mounting  Supplied in a 1517-BBGA (1517-FBGA, 40 × 40) footprint with surface-mount mounting for compact board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implements complex digital functions and custom hardware accelerators using the device’s large logic element and LAB count.
• Data buffering and on-chip storage  Uses approximately 19.456 Mbits of embedded RAM for packet buffering, FIFOs, and intermediate data storage.
• High-speed serial interfaces  Leverages the Stratix V GX transceiver speed grades for designs that require multi-gigabit serial connectivity.
• Large I/O systems  Utilizes up to 696 I/Os to connect to parallel buses, peripherals, and board-level interfaces.

Unique Advantages

• High logic density: The device’s ~340,000 logic elements and 128,300 LAB count support large-scale logic integration on a single chip, reducing system-level component count.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM provides local storage for buffering and state retention without external memory in many use cases.
• Extensive I/O availability: 696 I/Os enable flexible board-level connectivity and support for multiple parallel interfaces simultaneously.
• Multi-gigabit serial capability: GX transceiver speed grades listed in the Stratix V documentation support high-speed serial links for communications and data transport.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Low-voltage core operation: Core supply range of 820 mV–880 mV aligns with the device’s power architecture for contemporary FPGA deployments.

Why Choose 5SGXEA3K2F40I2LN?

The 5SGXEA3K2F40I2LN offers a combination of very large programmable logic resources, substantial embedded memory, and a high I/O count in an industrial-grade Stratix V GX device package. Its specification set is suitable for complex, high-density FPGA designs that require both significant on-chip storage and extensive connectivity.

Manufactured under the Stratix V family, this device benefits from the documented electrical and switching characteristics provided in the Stratix V datasheet, enabling informed design decisions for performance, power, and thermal considerations.

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