5SGXEA3K2F40I2L

The 5SGXEA3K2F40I2L is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade. This high-density device integrates 340,000 logic elements and approximately 19.5 Mbits of on-chip RAM to support complex digital processing and embedded memory workloads.

With 696 user I/Os, a FCBGA 1517-package footprint, and a low-voltage core supply range of 820 mV to 880 mV, the device targets high-performance systems that require large logic capacity, extensive I/O, and industrial operating temperature support.

Key Features

• Core Logic — 340,000 logic elements provide substantial programmable logic capacity for large-scale designs and dense logic implementations.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive algorithms.
• I/O Density — 696 user I/O pins enable broad connectivity for parallel interfaces, control signals, and multi-channel I/O subsystems.
• Package & Mounting — 1517-BBGA (FCBGA) package with a 1517-FBGA (40×40) supplier package footprint; surface-mount assembly.
• Power — Core supply range of 820 mV to 880 mV for low-voltage core operation.
• Operating Temperature — Industrial-grade range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards Compliance — RoHS-compliant component.
• Stratix V GX Series Characteristics — As a Stratix V GX device, it aligns with the series’ electrical and transceiver characteristics described in the device datasheet, including industrial speed grade offerings.

Typical Applications

• High-speed communications — Large logic capacity and Stratix V GX transceiver characteristics support system designs that require multi-channel serial connectivity and data-plane processing.
• Network and packet processing — Embedded RAM and abundant logic elements enable packet buffering, lookup tables, and custom packet-processing pipelines.
• Advanced signal processing — Dense logic and memory resources accommodate complex DSP functions, aggregation, and real-time processing tasks.

Unique Advantages

• High logic density: 340,000 logic elements allow integration of large, complex logic functions on a single device, reducing system component count.
• Significant embedded memory: Approximately 19.5 Mbits of on-chip RAM supports large buffers and state storage without external memory.
• Extensive I/O capability: 696 I/O pins provide flexible interfacing for high-pin-count system designs and multiple parallel channels.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation across a wide ambient range.
• Compact BGA packaging: 1517 FCBGA footprint enables a high-density board layout while preserving mechanical reliability for surface-mount assembly.
• Low-voltage core operation: 820 mV–880 mV supply range supports modern low-voltage system power architectures.

Why Choose 5SGXEA3K2F40I2L?

The 5SGXEA3K2F40I2L delivers a combination of high logic capacity, sizable embedded memory, and broad I/O connectivity in an industrial-grade Stratix V GX FPGA. Its package and electrical characteristics make it suitable for demanding applications that require dense programmable logic and robust thermal tolerance.

This device is well suited for engineers building high-performance communications, networking, and signal-processing systems who need scalable logic resources, on-chip memory, and a large number of I/Os in a single FPGA platform backed by the Stratix V device family specifications.

Request a quote or submit your requirements to receive pricing and availability information for the 5SGXEA3K2F40I2L. Our team will assist with lead time and procurement details to support your design schedule.