5SGXEA3K2F40C3N

The 5SGXEA3K2F40C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density logic and extensive I/O integration. Built as a commercial-grade device in a 1517-BBGA FCBGA package, it delivers large programmable logic capacity and substantial on-chip memory for complex digital designs.

This device targets applications that need many logic resources and high pin counts, offering a balance of performance and integration through its large logic element count, approximately 19.456 Mbits of embedded memory, and 696 user I/O pins.

Key Features

• Core Logic  Approximately 340,000 logic elements (cells) to implement complex, high-density digital logic and state machines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity  696 user I/Os provide extensive connectivity for high-pin-count system interfaces and parallel buses.
• Power  Core supply voltage range of 820 mV to 880 mV, enabling defined power-domain design and supply planning.
• Package & Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount FCBGA format to support compact board layouts.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory  RoHS-compliant construction for environmental and regulatory alignment.

Typical Applications

• High-density digital systems  Use the large logic capacity to consolidate multiple functions or accelerate complex algorithms in a single FPGA.
• Data buffering and packet processing  Leverage approximately 19.456 Mbits of embedded memory for packet buffering, FIFOs, and lookup tables.
• High-pin-count interfaces  The 696 user I/Os enable integration with wide parallel buses, multi-lane interfaces, and extensive peripheral arrays.
• Compact, surface-mount designs  The 1517-BBGA FCBGA package supports dense PCB routing and space-constrained system layouts.

Unique Advantages

• Substantial logic resource pool: The device's ~340,000 logic elements let you implement complex functions and higher integration on a single FPGA, reducing the need for multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM provides local storage for low-latency buffering and state retention without external memory.
• Extensive I/O connectivity: 696 I/Os simplify board-level interfacing for systems requiring many signals or parallel data paths.
• Defined power envelope: A specified core voltage range (820 mV–880 mV) supports predictable power budgeting and thermal planning.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial deployments and system-level thermal profiles.
• RoHS compliance: Built to meet RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEA3K2F40C3N?

The 5SGXEA3K2F40C3N positions itself as a high-density, commercially graded Stratix V GX FPGA suitable for designs that require large programmable logic resources, significant embedded memory, and extensive I/O. Its package and surface-mount form factor support compact board layouts while the documented voltage and temperature ranges enable predictable system integration.

This device is well-matched to engineering teams consolidating functionality into a single FPGA, implementing complex digital processing pipelines, or building systems with high I/O counts and substantial on-chip memory needs. The RoHS compliance and commercial temperature rating provide a balance of regulatory alignment and operational suitability for a wide range of commercial products.

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