5SGXEA3K2F40C3WN

The 5SGXEA3K2F40C3WN is a Stratix V GX family FPGA in a 1517-BBGA FCBGA package, offered as a commercial-grade, surface-mount device. It delivers very large programmable logic capacity, substantial on-chip memory, and high I/O density for designs that require extensive logic resources and connectivity.

This device is specified for a 0 °C to 85 °C operating range and a core supply voltage between 820 mV and 880 mV, making it suitable for commercial embedded and high-performance digital applications that match those environmental and power constraints.

Key Features

• Core logic capacity — Approximately 340,000 logic elements to implement large, complex FPGA designs and custom digital logic.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM for data buffering, state storage, and high-throughput processing tasks.
• I/O density — 696 user I/O pins to support wide parallel interfaces, high-channel counts, or extensive peripheral connectivity.
• Package and mounting — 1517-BBGA (FCBGA) package in a 1517-FBGA (40×40) supplier package footprint; surface-mount for standard board assembly.
• Power — Core supply voltage range of 820 mV to 880 mV to match platform power architectures that meet this domain.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for commercial-environment deployments.
• Regulatory — RoHS compliant.

Typical Applications

• High-performance digital systems — Use the large logic element count and embedded RAM to implement complex data-paths, custom accelerators, and control logic.
• Communications and networking — Leverage the high I/O count for wide parallel interfaces, protocol bridging, and multi-channel connectivity.
• Data processing and aggregation — Deploy on-chip memory and dense logic to handle buffering, preprocessing, and packet or stream manipulation.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable large-scale integration of custom logic and state machines without external gate arrays.
• Substantial embedded memory: Around 19.456 Mbits of RAM supports internal buffering and local data storage, reducing dependence on external memory for many tasks.
• Extensive I/O capability: 696 I/O pins provide flexibility for multi-lane interfaces, broad peripheral support, and high channel counts.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance align the device with commercial product and manufacturing requirements.
• FCBGA surface-mount package: The 1517-BBGA footprint supports standard PCB assembly processes and high-density board designs.
• Defined core power domain: Operation at 820–880 mV core supply aligns with platforms using low-voltage FPGA cores and power sequencing strategies.

Why Choose 5SGXEA3K2F40C3WN?

The 5SGXEA3K2F40C3WN combines a very large logic resource pool, substantial on-chip RAM, and a high I/O count in a commercial-grade Stratix V GX FPGA package. It is targeted at designs that need dense programmable logic, significant embedded memory, and broad connectivity while operating within commercial temperature and low-voltage core constraints.

This device is appropriate for engineering teams building complex digital systems, communications equipment, and data-processing modules that require scalable logic capacity and robust I/O in a surface-mount FCBGA form factor. The combination of verified specifications and RoHS compliance supports reliable integration into commercial product lines.

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