5SGXEA3K2F40C2WN

The 5SGXEA3K2F40C2WN is a commercial-grade Stratix V GX FPGA IC offering a high-density programmable logic solution. It integrates approximately 340,000 logic elements and roughly 19.456 Mbits of embedded memory to support large, complex digital designs.

Designed in a 1517-FBGA (40×40) surface-mount package with 696 user I/Os, this device targets designs requiring high logic capacity, substantial on-chip RAM, and a compact high-pin-count package. The device operates from a core supply range of 870 mV to 930 mV and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 
  Approximately 340,000 logic elements provide the capacity to implement large-scale digital functions and complex state machines.
• Embedded Memory 
  Approximately 19.456 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive algorithms.
• High I/O Count 
  696 user I/Os enable dense external connectivity and flexible interface routing for multi-channel systems.
• Package & Mounting 
  1517-BBGA (FCBGA) supplier package (1517-FBGA, 40×40) in a surface-mount format for compact board footprint and high pin density.
• Power and Operating Range 
  Core voltage supply range of 870 mV to 930 mV; commercial operating temperature range of 0 °C to 85 °C.
• Commercial Grade 
  Device is specified for commercial temperature grades and speed offerings as described for the Stratix V GX family.

Typical Applications

• Complex digital logic and compute 
  Large logic capacity and substantial embedded memory make the device suitable for heavy digital processing and custom hardware accelerators.
• High-density I/O systems 
  With 696 I/Os in a compact FBGA package, the device is appropriate for designs that require many parallel interfaces or board-level multiplexing.
• High-speed serial communication systems 
  As part of the Stratix V GX family, the device aligns with designs that leverage the family’s transceiver speed-grade offerings for serial link implementations.

Unique Advantages

• High integration density: A large logic element count reduces the need for multiple devices, simplifying system design and lowering BOM complexity.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory supports deep buffering and local data storage without external memory.
• Extensive I/O flexibility: 696 I/Os provide headroom for multi-channel interfaces, parallel buses, and high-pin-count peripherals.
• Compact, high-pin-count package: The 1517-FBGA (40×40) package delivers dense connectivity in a surface-mount footprint suitable for space-constrained boards.
• Predictable power and thermal envelope: Specified core supply range (870–930 mV) and commercial operating temperature (0 °C–85 °C) support planned power and thermal design.

Why Choose 5SGXEA3K2F40C2WN?

This Stratix V GX FPGA combines high logic density, significant embedded memory, and a large I/O complement in a compact 1517-FBGA package, making it well suited for demanding digital designs that require substantial on-chip resources. Its commercial-grade specification and defined core voltage window provide predictable integration into system-level power and thermal plans.

Designers seeking a high-capacity, programmable solution for complex logic, memory-intensive functions, and dense I/O routing will find the 5SGXEA3K2F40C2WN appropriate for scalable designs where on-chip resources and package density are primary considerations.

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