5SGXEA3K2F40C2L

The 5SGXEA3K2F40C2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC optimized for high-density, I/O-rich designs. It combines 340,000 logic elements with large on‑chip memory and a wide voltage operating window to support complex digital signal processing, protocol bridging, and system integration tasks.

Designed for commercial temperature environments, this device targets applications that require deep embedded memory, extensive I/O, and a high level of integration in a 1517‑ball FCBGA package.

Key Features

• Core Logic 340,000 logic elements for implementing large, complex digital designs and compute-intensive functions.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage without external memory.
• I/O Density 696 user I/O pins to accommodate multi‑lane interfaces, wide buses, and extensive peripheral connectivity.
• Power Supply Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Package & Mounting 1517‑BBGA (FCBGA) package with supplier package designation 1517‑FBGA (40×40), surface mount for compact system integration.
• Temperature Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory RoHS compliant.

Typical Applications

• High‑density digital processing — Implements large-scale logic for signal processing, protocol engines, and custom compute pipelines using 340,000 logic elements and substantial on‑chip RAM.
• Network and communications systems — Suited for designs that require many I/O lanes and on‑chip buffering for packet handling or protocol bridging.
• Data aggregation and interfacing — Ideal for systems that consolidate multiple high‑pin‑count peripherals or sensors into a single programmable fabric.

Unique Advantages

• High logical density: 340,000 logic elements enable consolidation of complex functions into one FPGA, reducing bill‑of‑materials and board area.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM supports deep buffering and state machines without immediate external memory needs.
• Extensive I/O capability: 696 I/O pins provide flexibility for wide parallel interfaces, multiple serial lanes, or high pin‑count peripherals.
• Compact, manufacturable package: 1517‑ball FCBGA package supports high integration density in a surface‑mount form factor suitable for production assembly.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C to match mainstream embedded and enterprise applications.
• Standards‑aware supply: RoHS compliance eases environmental conformity for global product deployment.

Why Choose 5SGXEA3K2F40C2L?

The 5SGXEA3K2F40C2L provides a balanced combination of logic capacity, embedded memory, and I/O count in a production‑friendly FCBGA package for commercial applications. Its configuration makes it suitable for teams building high‑integration systems that need large programmable fabric and on‑chip RAM to minimize external components.

This Stratix V GX device leverages family capabilities documented in the Stratix V device datasheet and is targeted at designers who require a high‑density FPGA with extensive I/O and memory resources for scalable, long‑lifecycle systems.

Request a quote or submit a procurement inquiry to receive pricing, availability, and support information for part number 5SGXEA3K2F40C2L.