5SGXEA3K2F40C1G

The 5SGXEA3K2F40C1G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1517-ball BGA (FCBGA) package for surface-mount assembly. This commercial-grade device delivers very high logic capacity, substantial on-chip RAM, and a large I/O count for complex, high-density digital designs.

Typical deployment scenarios include systems that require extensive programmable logic, significant embedded memory, and many signal interfaces where board-level integration and scalability are priorities.

Key Features

• Core Logic  Approximately 340,000 logic elements, enabling large-scale programmable logic implementations and complex RTL designs.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM (19,456,000 total RAM bits) for buffering, FIFOs, and scratchpad storage.
• I/O Capacity  696 I/O pins to support extensive external interfaces and parallel connectivity on high-density boards.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements for Stratix V devices.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device suitable for standard PCB assembly processes.
• Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• High-density signal processing  Large logic capacity and significant on-chip RAM enable complex DSP, packet processing, and algorithm acceleration implementations.
• Networking and communications  Extensive I/O and programmable logic support protocol handling, bridging, and custom interface logic for networking equipment.
• Board-level acceleration  Used as a programmable accelerator in systems requiring customizable datapaths and hardware offload.

Unique Advantages

• High logic integration: Supports large, complex designs with approximately 340,000 logic elements, reducing the need for multiple smaller FPGAs.
• Substantial on-chip RAM: Approximately 19.46 Mbits of embedded memory for efficient on-chip buffering and low-latency data handling.
• Extensive I/O count: 696 I/Os provide flexibility for interfacing with numerous peripherals, high-pin-count connectors, and parallel buses.
• Commercial availability: Commercial-grade operating range (0 °C to 85 °C) fits a wide range of standard electronic products and systems.
• Compact package: 1517-BBGA (1517-FBGA supplier package) provides a compact footprint for high-density PCB designs while supporting surface-mount manufacturing.
• Regulatory readiness: RoHS compliance simplifies use in lead-free assembly workflows.

Why Choose 5SGXEA3K2F40C1G?

The 5SGXEA3K2F40C1G positions itself where very high logic density, abundant embedded RAM, and a large number of I/Os are essential. Its Stratix V GX heritage provides a proven FPGA architecture in a commercial-grade package, making it suitable for demanding board-level applications that need scalable programmable logic and on-chip memory resources.

Design teams targeting complex signal processing, networking, or hardware-accelerated functions will benefit from the device's combination of logic capacity, memory, and I/O density, along with straightforward surface-mount packaging and RoHS compliance for production-ready designs.

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