5SGXEA3K2F40I3LG

The 5SGXEA3K2F40I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a high-pin-count 1517-BBGA FCBGA package. It delivers large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade, surface-mount package for designs that require integration and reliability across a wide temperature range.

Targeted at applications that need high logic density, extensive I/O connectivity, and robust operating conditions, this device provides designers with a configurable silicon platform optimized for complex digital systems.

Key Features

• Logic Capacity  340,000 logic elements, supporting high-density digital implementations and complex logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Count  696 user I/O pins for broad peripheral connectivity and dense board-level interconnects.
• Power  Core supply range specified at 820 mV to 880 mV for the device core operating voltage.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in demanding thermal environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Network and Communications  Large logic capacity and high I/O count accommodate protocol processing, packet handling, and complex interface aggregation.
• High-Density Signal Processing  Significant embedded memory and extensive logic resources support buffering and real-time data manipulation for DSP workloads.
• Industrial Control  Industrial temperature rating and broad I/O enable deployment in control systems and factory automation requiring reliable operation across −40 °C to 100 °C.
• Custom Compute Acceleration  Configurable logic and on-chip memory allow hardware acceleration of compute-intensive algorithms and application-specific datapaths.

Unique Advantages

• High logic density: 340,000 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM provides deep buffering and local storage for latency-sensitive tasks.
• Extensive I/O: 696 I/O pins enable numerous peripherals and high-bandwidth board-level interfaces without external multiplexing.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in thermally challenging environments.
• Compact, high-pin-count packaging: 1517-BBGA (1517-FBGA, 40×40) offers a dense package suitable for space-constrained, high-performance designs.
• RoHS compliance: Conforms to lead-free manufacturing requirements for environmentally conscious designs.

Why Choose 5SGXEA3K2F40I3LG?

The 5SGXEA3K2F40I3LG positions itself as a high-capacity Stratix V GX FPGA emphasizing logic density, embedded memory, and a large I/O complement in an industrial-rated, surface-mount package. It is suited to engineers building complex digital systems that require integrated memory resources, flexible I/O, and reliable operation across a wide temperature range.

This device is appropriate for teams looking to consolidate functionality into a single FPGA to simplify system architecture, reduce component count, and maintain design scalability with Intel Stratix V family documentation and specifications available for reference.

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