5SGXEA3K3F35I3LN

The 5SGXEA3K3F35I3LN is an industrial‑grade Stratix® V GX field programmable gate array (FPGA) IC designed for high‑density, compute‑intensive designs. It combines a large programmable logic capacity with substantial on‑chip memory and broad I/O support, making it suitable for complex digital processing, networking, and embedded control applications.

This device is delivered in a 1152‑FBGA (35×35) package and is specified for operation from −40 °C to 100 °C with a core supply voltage range of 820 mV to 880 mV, enabling deployment in industrial environments requiring extended temperature capability and stable core power.

Key Features

• Programmable Logic — 340,000 logic elements provide large-scale programmable fabric for complex logic, datapaths, and custom acceleration functions.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM to support buffering, look‑up tables, and state storage for high‑performance designs.
• High I/O Count — 432 I/O pins to support wide external interfacing for high‑bandwidth systems, multi‑lane interfaces, and extensive peripheral connectivity.
• Industrial Grade Temperature — Rated for operation from −40 °C to 100 °C for use in industrial temperature environments.
• Package and Mounting — 1152‑BBGA/FCBGA (supplier package: 1152‑FBGA, 35×35) surface‑mount package optimized for board‑level integration.
• Core Voltage — Specified core supply voltage range of 820 mV to 880 mV to match platform power architectures and ensure predictable core behavior.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• High‑Performance Packet Processing — Use the large logic element count and abundant I/O to implement packet parsing, switching, and custom forwarding pipelines for networking equipment.
• Signal Processing and Acceleration — Deploy embedded RAM and extensive logic resources to implement DSP chains, filters, and hardware accelerators for communications and imaging systems.
• Industrial Control Systems — Industrial temperature rating and robust I/O make this device suitable for real‑time control, motor control interfaces, and factory automation logic.
• Prototyping and System Integration — High logic density and I/O flexibility support system‑level prototyping, integration of multiple peripherals, and consolidation of board‑level functions.

Unique Advantages

• Substantial Logic Density: 340,000 logic elements enable consolidation of complex digital functions into a single FPGA, reducing board complexity.
• Significant On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and stateful processing without external memory for many functions.
• Broad I/O Capability: 432 I/O pins allow flexible connectivity to multiple external devices, high‑speed interfaces, and parallel datapaths.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet environmental demands of industrial deployments.
• Compact, High‑Pin Package: 1152‑FBGA (35×35) package offers a high‑pin‑count solution in a compact footprint for dense PCBs.
• Controlled Core Supply Window: 820 mV–880 mV supply specification enables predictable power sequencing and design alignment with platform regulators.

Why Choose 5SGXEA3K3F35I3LN?

The 5SGXEA3K3F35I3LN positions itself as a high‑density, industrial‑grade Stratix V GX FPGA for designs that require extensive programmable logic, substantial on‑chip memory, and a large I/O complement. Its combination of 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 432 I/O pins makes it well suited for demanding networking, signal processing, and industrial control applications where integration and performance density matter.

Engineers selecting this device gain scalability and robustness for medium‑to‑high complexity systems, along with environmental tolerance for industrial deployments and a package optimized for high‑pin integration on modern PCBs.

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