5SGXEA3K3F35I4N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,412 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXEA3K3F35I4N – Stratix V GX FPGA, 340000 logic elements, 1152-BBGA
The 5SGXEA3K3F35I4N is a Stratix® V GX field-programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package, offered as an industrial-grade device. It delivers substantial on-chip resources including 340,000 logic elements and approximately 19.456 Mbits of embedded memory, together with a high 432-pin I/O count.
These attributes make the device suitable for designs that require large logic capacity, significant embedded RAM, and extensive I/O connectivity while operating across an industrial temperature range and low core voltage supply.
Key Features
- Logic Capacity Approximately 340,000 logic elements for largescale custom logic, parallel processing, and complex state machines.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and memory-intensive algorithms.
- I/O Density 432 I/O pins to support wide bus interfaces, numerous peripherals, and rich board-level connectivity.
- Package 1152-BBGA (FCBGA) 35×35 supplier package suitable for high-pin-count, compact surface-mount PCB layouts.
- Industrial Grade & Temperature Range Specified for industrial operation from −40 °C to 100 °C for deployment in harsh or wide-temperature environments.
- Core Voltage Low-voltage operation with a supply range of 820 mV to 880 mV for the device core.
- Mounting Surface-mount package suitable for modern SMT assembly processes.
- Compliance RoHS-compliant for alignment with lead-free manufacturing requirements.
Typical Applications
- High-density signal processing Use the large logic element count and embedded memory to implement DSP blocks, custom accelerators, and parallel processing pipelines.
- Complex protocol bridging and I/O aggregation 432 I/Os allow aggregation and translation of multiple high-pin-count interfaces on a single device.
- Industrial controls and automation Industrial-grade temperature range and robust packaging make the device suitable for factory automation, motor control logic, and process control systems.
- Large-scale custom logic implementations Implement extensive finite-state machines, control logic, and system orchestration functions using the device’s high logic capacity and memory.
Unique Advantages
- Large programmable fabric Approximately 340,000 logic elements reduce the need for multi-chip partitioning in large designs.
- Significant on-chip memory Around 19.456 Mbits of embedded RAM supports buffering, datasets, and state storage without immediate external memory dependence.
- High I/O count 432 I/Os provide flexibility for dense board-level connectivity and multiple peripheral interfaces.
- Industrial temperature qualification Rated from −40 °C to 100 °C for reliable operation across extended environmental ranges.
- Compact high-pin-count package 1152-BBGA (35×35) enables a high-density footprint for systems where board space and pin count are critical.
- RoHS compliant Meets lead-free manufacturing requirements for modern production environments.
Why Choose 5SGXEA3K3F35I4N?
The 5SGXEA3K3F35I4N combines a large logic fabric, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX device. Its low core-voltage operation and compact 1152-BBGA package make it a practical choice for designers needing high integration density, robust thermal performance, and flexible interfacing on complex PCBs.
This device is well suited to engineering teams and procurement groups implementing large custom logic, memory-heavy processing, or dense I/O aggregation in industrial environments where on-chip resources and temperature resilience are required.
Request a quote or submit an RFQ for part number 5SGXEA3K3F35I4N to receive pricing and availability information tailored to your project requirements.

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