5SGXEA3K3F35I4N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 1,412 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K3F35I4N – Stratix V GX FPGA, 340000 logic elements, 1152-BBGA

The 5SGXEA3K3F35I4N is a Stratix® V GX field-programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package, offered as an industrial-grade device. It delivers substantial on-chip resources including 340,000 logic elements and approximately 19.456 Mbits of embedded memory, together with a high 432-pin I/O count.

These attributes make the device suitable for designs that require large logic capacity, significant embedded RAM, and extensive I/O connectivity while operating across an industrial temperature range and low core voltage supply.

Key Features

  • Logic Capacity  Approximately 340,000 logic elements for largescale custom logic, parallel processing, and complex state machines.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and memory-intensive algorithms.
  • I/O Density  432 I/O pins to support wide bus interfaces, numerous peripherals, and rich board-level connectivity.
  • Package  1152-BBGA (FCBGA) 35×35 supplier package suitable for high-pin-count, compact surface-mount PCB layouts.
  • Industrial Grade & Temperature Range  Specified for industrial operation from −40 °C to 100 °C for deployment in harsh or wide-temperature environments.
  • Core Voltage  Low-voltage operation with a supply range of 820 mV to 880 mV for the device core.
  • Mounting  Surface-mount package suitable for modern SMT assembly processes.
  • Compliance  RoHS-compliant for alignment with lead-free manufacturing requirements.

Typical Applications

  • High-density signal processing  Use the large logic element count and embedded memory to implement DSP blocks, custom accelerators, and parallel processing pipelines.
  • Complex protocol bridging and I/O aggregation  432 I/Os allow aggregation and translation of multiple high-pin-count interfaces on a single device.
  • Industrial controls and automation  Industrial-grade temperature range and robust packaging make the device suitable for factory automation, motor control logic, and process control systems.
  • Large-scale custom logic implementations  Implement extensive finite-state machines, control logic, and system orchestration functions using the device’s high logic capacity and memory.

Unique Advantages

  • Large programmable fabric  Approximately 340,000 logic elements reduce the need for multi-chip partitioning in large designs.
  • Significant on-chip memory  Around 19.456 Mbits of embedded RAM supports buffering, datasets, and state storage without immediate external memory dependence.
  • High I/O count  432 I/Os provide flexibility for dense board-level connectivity and multiple peripheral interfaces.
  • Industrial temperature qualification  Rated from −40 °C to 100 °C for reliable operation across extended environmental ranges.
  • Compact high-pin-count package  1152-BBGA (35×35) enables a high-density footprint for systems where board space and pin count are critical.
  • RoHS compliant  Meets lead-free manufacturing requirements for modern production environments.

Why Choose 5SGXEA3K3F35I4N?

The 5SGXEA3K3F35I4N combines a large logic fabric, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX device. Its low core-voltage operation and compact 1152-BBGA package make it a practical choice for designers needing high integration density, robust thermal performance, and flexible interfacing on complex PCBs.

This device is well suited to engineering teams and procurement groups implementing large custom logic, memory-heavy processing, or dense I/O aggregation in industrial environments where on-chip resources and temperature resilience are required.

Request a quote or submit an RFQ for part number 5SGXEA3K3F35I4N to receive pricing and availability information tailored to your project requirements.

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