5SGXEA3K3F40C2LN

The 5SGXEA3K3F40C2LN is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1517‑ball FCBGA package. This device integrates a high density of programmable logic, large on‑chip RAM, and a high I/O count to support complex digital designs.

Its architecture and electrical characteristics, as documented in the Stratix V device datasheet, target high‑performance applications that require dense logic resources, substantial embedded memory, and extensive I/O connectivity.

Key Features

• Logic Capacity — 340,000 logic elements (logic cells) for implementing complex digital functions and large gate counts.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM to support large buffers, FIFOs, and on‑device data storage.
• I/O Resources — Up to 696 user I/O pins, enabling wide external connectivity and high‑pin‑count system designs.
• Package and Mounting — 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); surface‑mount mounting type for board‑level integration.
• Power and Core Supply — Core supply operating range 820 mV to 880 mV, consistent with modern low‑voltage FPGA core domains.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards Compliance — RoHS compliant.
• Stratix V Family Characteristics — Device follows Stratix V electrical and switching characteristic definitions, including documented transceiver and I/O timing behavior in the device datasheet.

Typical Applications

• High‑density digital systems — Implement large FPGA designs that require hundreds of thousands of logic elements for complex state machines, datapaths, and custom accelerators.
• Memory‑intensive designs — Use the approximately 19.456 Mbits of embedded RAM for buffering, packet queues, and on‑chip data processing.
• I/O‑heavy systems — Leverage up to 696 I/Os for wide parallel interfaces, multiple peripheral connections, and board‑level integration.
• High‑performance FPGA platforms — Deploy in applications that rely on the Stratix V family’s documented electrical and switching characteristics for predictable timing and transceiver behavior.

Unique Advantages

• High logic density: 340,000 logic elements provide the headroom needed for large, integrated digital designs without external logic overhead.
• Substantial on‑chip memory: Approximately 19.456 Mbits of RAM reduces dependence on external memory for many buffering and real‑time processing tasks.
• Extensive I/O connectivity: 696 I/Os simplify system partitioning and reduce the need for I/O expanders or multiplexing.
• Compact FCBGA package: 1517‑BBGA (40×40) packaging supports dense board layouts while preserving a high I/O count.
• Low‑voltage core operation: Core supply in the 0.82–0.88 V range aligns with contemporary low‑power FPGA core domains.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGXEA3K3F40C2LN?

This Stratix® V GX FPGA delivers a balanced combination of dense programmable logic, significant on‑chip memory, and very high I/O capacity in a compact FCBGA package. It is suited for engineers and system designers building complex digital platforms that require on‑device memory and extensive external interfacing within a commercial temperature range.

Built to the Stratix V family electrical and switching specifications, the 5SGXEA3K3F40C2LN provides a clearly defined platform for high‑performance FPGA implementations where predictable timing, board integration, and resource density are priorities.

Request a quote or submit an RFQ today to evaluate the 5SGXEA3K3F40C2LN for your next high‑density FPGA design.