5SGXEA3K3F40C2N

The 5SGXEA3K3F40C2N is an Intel Stratix V GX field programmable gate array supplied in a 1517-BBGA FCBGA package. It provides a high-density, commercial-grade FPGA fabric with a large logic capacity, significant on-chip RAM, and extensive I/O for complex digital designs.

This device is targeted at applications requiring dense logic integration and a large number of I/O channels, offering a balance of integration and platform-level flexibility within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements (cells) to implement large FPGA designs and complex logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
• I/O Density  696 device I/Os supporting high pin-count designs and extensive peripheral integration.
• Power and Core Supply  Core voltage supply range of 870 mV to 930 mV, allowing designers to plan accurate power delivery and decoupling for the FPGA core.
• Package and Mounting  1517-BBGA (FCBGA) package, supplier package noted as 1517-FBGA (40×40), with surface-mount assembly for compact board layouts.
• Operating Range  Commercial temperature grade rated from 0 °C to 85 °C suitable for commercial electronic applications.
• Regulatory Compliance  RoHS-compliant to meet standard lead-free environmental requirements.

Typical Applications

• High-density digital systems  Use the device’s large logic capacity and on-chip memory to implement complex digital signal processing and control logic.
• High I/O interface designs  The 696 I/Os facilitate integration with multiple peripherals, sensors, and bus interfaces in multi-channel systems.
• Prototype and platform development  Commercial-grade FPGA resources are suited for development platforms and production systems within the specified temperature and supply ranges.

Unique Advantages

• Large logic fabric: Approximately 340,000 logic elements enable integration of sizeable digital subsystems on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports buffering and data-path storage without relying on external memory for many workloads.
• High I/O count: 696 I/Os provide flexibility to connect numerous external interfaces and parallel data channels directly to the FPGA.
• Compact FCBGA package: The 1517-BBGA (1517-FBGA supplier package) delivers high pin density in a surface-mount form factor for space-constrained boards.
• Commercial temperature rating: Rated from 0 °C to 85 °C for reliable operation in commercial environments and deployments.
• RoHS compliance: Meets common environmental and manufacturing requirements for modern electronics production.

Why Choose 5SGXEA3K3F40C2N?

The 5SGXEA3K3F40C2N delivers a combination of high logic density, substantial embedded memory, and a high I/O count in a compact FCBGA package—making it well suited for commercial designs that require on-chip integration of complex logic and extensive external interfacing. Its documented core supply range and commercial operating temperature provide clear parameters for power and thermal planning during system design.

This part is appropriate for engineers and procurement teams designing platform-level FPGA solutions where integration density, I/O capacity, and compliance with RoHS are important considerations. Its specification set supports scalable designs and predictable integration into commercial electronic products.

Request a quote or submit a pricing inquiry today to evaluate 5SGXEA3K3F40C2N for your next FPGA-based design.