5SGXEA3K3F40C3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 19456000 340000 1517-BBGA, FCBGA

Quantity 730 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3K3F40C3G – Stratix V GX FPGA, 340000 Logic Elements, 696 I/Os, 1517-BBGA

The 5SGXEA3K3F40C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic capacity and embedded memory in a surface-mount 1517-BBGA (1517-FBGA, 40×40) package, targeted for commercial-temperature designs.

With 340,000 logic elements, approximately 19.5 Mbits of on‑chip RAM, and 696 I/O pins, this device is specified for applications that require substantial programmable logic, significant on-chip buffering, and dense I/O connectivity while operating at a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Logic  340,000 logic elements provide large programmable logic capacity for complex designs and high gate-count implementations.
  • Embedded Memory  Approximately 19.5 Mbits of on-chip RAM support local buffering, FIFOs, and on‑device data storage for logic-intensive applications.
  • I/O Density  696 I/O pins enable extensive external interfacing and flexible board-level system integration.
  • Physical Package  1517-BBGA (supplier package: 1517-FBGA, 40×40) surface-mount package for high pin-count, high-density PCB layouts.
  • Power  Core supply voltage specified from 820 mV to 880 mV to match system power-rail requirements and power-management strategies.
  • Temperature Grade & Mounting  Commercial temperature grade with operating range 0 °C to 85 °C; surface-mount mounting type for standard assembly processes.
  • Standards Compliance  RoHS compliant for use in assemblies that require lead-free materials and compliance with environmental directives.

Unique Advantages

  • High logic capacity: 340,000 logic elements enable implementation of large, complex FPGA designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
  • Extensive I/O connectivity: 696 I/Os support dense peripheral and high-speed interface requirements on a single device.
  • Compact, high-pin package: 1517-BBGA (40×40) balances high I/O count with a compact board footprint for space-constrained designs.
  • Commercial temperature coverage: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • Manufacturer documentation: Device characteristics and electrical/switching specifications are supported by the Stratix V device datasheet from Intel/Altera.

Why Choose 5SGXEA3K3F40C3G?

This Stratix V GX FPGA is positioned for designs that require a high number of logic elements, significant embedded memory, and dense I/O in a single commercial-grade BGA package. Its controlled core voltage range and RoHS compliance make it suitable for production systems that prioritize integration and documented electrical behavior.

Engineers and procurement teams looking for a documented, high-capacity Intel Stratix V GX device will find the 5SGXEA3K3F40C3G appropriate for complex programmable logic implementations where on-chip resources and I/O density matter.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the 5SGXEA3K3F40C3G.

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