5SGXEA3K3F40C4N

The 5SGXEA3K3F40C4N is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. This device provides large on-chip programmable logic and memory capacity together with an extensive I/O count in a surface-mount FCBGA package.

Engineered for designs that require substantial logic resources, embedded memory, and dense I/O, the part is suited to applications where integration and system-level flexibility are primary considerations.

Key Features

• Logic Capacity  Approximately 340,000 logic elements (cells) to implement complex programmable logic and custom hardware functions.
• Logic Clusters  128,300 logic clusters (as listed) for large-scale design partitioning and resource planning.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  696 user I/Os to support multiple interfaces and parallel connections to external devices.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for PCB integration.
• Power  Core voltage supply range of 820 mV to 880 mV, as specified for device operation.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Large-scale programmable implementations that require substantial logic element counts and cluster resources.
• Data buffering and local memory  Designs that rely on significant on-chip RAM for temporary storage, FIFOs, or packet buffering.
• Multi-I/O systems  Applications needing many parallel or mixed-signaling interfaces utilizing the device's 696 I/Os.

Unique Advantages

• Large programmable fabric:  Approximately 340,000 logic elements support complex custom logic integration on a single device, reducing external component count.
• Substantial embedded memory:  About 19.5 Mbits of on-chip RAM enables local data staging and high-throughput buffering without immediate external memory dependencies.
• High I/O capacity:  696 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and parallel data streams.
• Compact surface-mount package:  1517-BBGA FCBGA packaging offers dense integration suitable for space-constrained PCB designs.
• Commercial temperature grade:  Rated for 0 °C to 85 °C operation to match typical commercial electronic deployments.
• RoHS compliant:  Meets environmental compliance requirements for lead-free manufacturing.

Why Choose 5SGXEA3K3F40C4N?

The 5SGXEA3K3F40C4N positions itself as a high-capacity Stratix V GX FPGA option for designers who need a combination of large logic resources, significant on-chip memory, and extensive I/O in a commercial-grade, surface-mount package. Its specified core voltage range and package information support clear power and PCB design planning.

This part is appropriate for teams building complex programmable solutions that emphasize integration density, local memory capacity, and flexible interfacing. Its Stratix V GX family heritage (as referenced in device documentation) aligns it with a mature FPGA architecture and supporting documentation.

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