5SGXEA3K3F40I3LN

The 5SGXEA3K3F40I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, designed to provide very large logic capacity and extensive I/O in a single surface-mount package. It delivers a combination of high logic element count, substantial on-chip memory, and an industrial operating temperature range for demanding embedded and system-level applications.

As a member of the Stratix V GX family (see the Stratix V device datasheet for series-level electrical and switching characteristics), this device targets designs that require large programmable logic resources, high I/O counts, and industrial-grade thermal performance.

Key Features

• Core Logic  Approximately 340,000 logic elements and 128,300 LABs, providing extensive programmable fabric for complex logic, DSP, and glue-logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage without external memory for many design tasks.
• I/O Capacity  696 user I/Os to support dense connectivity, multi-channel interfaces, and broad peripheral integration.
• Power and Supply  Core voltage supply range from 820 mV to 880 mV to match system power rails and power budgeting requirements.
• Package and Mounting  1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40), surface-mount package optimized for high pin count applications and compact board footprints.
• Thermal and Grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for extended-temperature applications.
• Compliance  RoHS compliant for alignment with environmental and manufacturing standards.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM enable complex algorithm implementation and parallel processing on a single device.
• Multi-channel I/O aggregation  696 I/Os support systems that require broad interface consolidation and signal routing in a compact form factor.
• Industrial control and automation  Industrial temperature rating and robust packaging make the device suitable for control, monitoring, and embedded computing in harsh environments.
• System integration and protocol bridging  Extensive logic and memory resources allow implementation of protocol conversion, bridging, and custom peripheral controllers without extensive external components.

Unique Advantages

• Very large programmable fabric:  Approximately 340,000 logic elements enable integration of multiple functions into a single FPGA, reducing board-level complexity.
• Significant on-chip memory:  About 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• High I/O count:  696 I/Os provide flexibility for complex system interconnects and high channel-density designs.
• Industrial temperature operation:  Rated from –40 °C to 100 °C to maintain functionality across a wide range of deployment conditions.
• Compact high-pin-count package:  1517-BBGA FCBGA (1517-FBGA, 40×40) combines a small footprint with a large number of available signals for dense system designs.
• RoHS compliant:  Meets lead-free manufacturing requirements for many production environments.

Why Choose 5SGXEA3K3F40I3LN?

The 5SGXEA3K3F40I3LN positions itself as a high-capacity, I/O-rich Stratix V GX FPGA suitable for designs that demand substantial programmable logic, significant embedded RAM, and broad connectivity in an industrial-temperature, surface-mount package. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of on-chip RAM, and 696 I/Os enables consolidation of functions and reduces external component count for system-level simplification.

This device is well suited to engineering teams building dense digital systems, multi-interface controllers, or industrial embedded platforms that require scalable, reliable programmable logic with the long-term support and documentation provided for the Stratix V family.

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