5SGXEA3K3F40I3N

The 5SGXEA3K3F40I3N is an Intel Stratix® V GX family FPGA offered in an industrial temperature grade. It delivers very-high logic density with approximately 340,000 logic elements and roughly 19.46 Mbits of embedded RAM, and supports a large I/O count for complex, I/O‑heavy designs.

Packaged in a 1517‑BBGA FCBGA (1517‑FBGA, 40×40) surface‑mount package and rated for operation from −40 °C to 100 °C, this device is specified with a core supply range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Core Logic  Approximately 340,000 logic elements to implement high-density programmable logic and complex custom architectures.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, state storage, and on‑chip data handling.
• I/O and Periphery  Up to 696 I/O pins to support dense external interfacing and parallel connectivity requirements.
• Transceiver Capability (series)  As part of the Stratix V GX family, the series documentation describes high-speed transceiver support for GX channels (see Stratix V device documentation for details).
• Package & Mounting  1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA, 40×40), surface mount for board‑level integration.
• Power  Core supply voltage specified between 820 mV and 880 mV for the FPGA core.
• Temperature & Grade  Industrial grade device with operating range from −40 °C to 100 °C for temperature‑sensitive deployments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic  Use where large arrays of logic and embedded memory are required to implement custom accelerators or complex control logic.
• High‑I/O systems  Suitable for designs that require many external interfaces or dense parallel connections thanks to up to 696 I/O pins.
• Industrial and temperature‑sensitive deployments  Industrial temperature rating (−40 °C to 100 °C) supports designs deployed in harsh or wide‑range thermal environments.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable integration of large, complex designs on a single device, reducing board count and system complexity.
• Substantial on‑chip memory: Approximately 19.46 Mbits of embedded RAM supports local buffering and data‑path storage without relying entirely on external memory.
• Extensive I/O: 696 available I/O pins give flexibility for multiple interfaces and high connector densities.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Compact BGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package balances footprint and pin density for board integration.
• Series documentation for high‑speed serials: The Stratix V GX family documentation includes details on transceiver and I/O timing characteristics for high‑speed serial links.

Why Choose 5SGXEA3K3F40I3N?

The 5SGXEA3K3F40I3N provides a combination of high logic capacity, significant embedded memory, and a large I/O complement in an industrial‑grade Stratix V GX FPGA. Its specified core voltage range, robust operating temperature window, and BGA packaging make it suitable for demanding designs that require dense programmable logic and reliable operation across broad thermal conditions.

Engineers selecting this device benefit from the Stratix V GX family documentation for detailed electrical and transceiver characteristics, enabling informed integration into systems that demand substantial on‑chip resources and a high degree of I/O flexibility.

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