5SGXEA3K3F40I4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 19456000 340000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXEA3K3F40I4G – Stratix® V GX FPGA, 340,000 logic elements, 1517-BBGA (FCBGA)
The 5SGXEA3K3F40I4G is a Stratix® V GX Field Programmable Gate Array (FPGA) offering a high-density programmable fabric combined with extensive I/O and embedded memory. As an industrial-grade device in an FCBGA package, it is intended for demanding systems that require large logic capacity, significant on-chip RAM, and broad I/O connectivity.
Key value propositions include a large population of logic resources and LABs, substantial on-chip RAM, support for low-voltage core operation, and an extended operating temperature range—attributes that address complex digital processing and system integration requirements in industrial environments.
Key Features
- Core Logic Approximately 340,000 logic elements and 128,300 LABs (logic array blocks) provide a high-density programmable fabric for complex logic and custom hardware acceleration.
- Embedded Memory Total on-chip RAM of approximately 19.456 Mbits supports large buffer, caching, and state-storage requirements without external memory.
- I/O Capacity 696 user I/Os enable extensive external interfacing for peripherals, sensors, and high-channel-count designs.
- Power Supply Core voltage supply range of 820 mV to 880 mV accommodates the device’s low-voltage core operation.
- Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for board-level integration.
- Temperature & Grade Industrial grade with an operating temperature range from -40 °C to 100 °C for deployment in temperature-challenging environments.
- Environmental Compliance RoHS compliant to support regulatory and environmental requirements.
Typical Applications
- Industrial Control & Automation High logic density and industrial temperature rating make this FPGA suitable for complex control algorithms, I/O interfacing, and real-time processing in industrial equipment.
- High-density Digital Signal Processing Large logic resources and substantial embedded RAM support DSP pipelines, packet processing, and custom data-path implementations.
- Communication and Networking Equipment Extensive I/O and Stratix V GX family transceiver support make the device appropriate for board-level designs in networking and telecommunication systems.
- System Integration & Prototyping The combination of logic capacity, on-chip memory, and high I/O count suits system integrators and hardware prototyping for complex FPGA-based subsystems.
Unique Advantages
- High logic density: 340,000 logic elements and 128,300 LABs enable consolidation of complex functions into a single device, reducing external component count.
- Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM lowers dependence on external memory for buffering and state storage, simplifying board design.
- Extensive connectivity: 696 I/Os provide flexible interfacing options for multi-channel and mixed-signal systems.
- Industrial robustness: Rated for -40 °C to 100 °C operation, supporting reliable performance in harsh ambient conditions.
- Compact, production-ready packaging: 1517-BBGA (FCBGA) surface-mount package and 1517-FBGA (40×40) supplier footprint facilitate automated assembly and dense PCB layouts.
- Regulatory compliance: RoHS compliance supports environmentally driven procurement and manufacturing requirements.
Why Choose 5SGXEA3K3F40I4G?
This Stratix V GX FPGA combines sizeable logic resources, ample embedded memory, and a high I/O count in an industrial-grade, surface-mount FCBGA package—making it well suited for engineers designing high-performance, space-efficient systems that must operate across a wide temperature range. Its core voltage range and package options support integration into modern low-voltage, high-density boards.
The device is targeted at teams requiring scalability and reliability for complex digital processing, communication, and control applications, delivering a balance of programmable capacity and system-level integration to simplify BOM and board design choices.
Request a quote or submit your design requirements to receive pricing and availability information for the 5SGXEA3K3F40I4G.

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