5SGXEA4H1F35C1G

The 5SGXEA4H1F35C1G is a Stratix® V GX field programmable gate array designed for high-density, high‑I/O system implementations. It integrates 420,000 logic elements and approximately 38 Mbits of on‑chip RAM to address complex digital signal processing, networking, and compute-acceleration tasks.

This device is supplied in a 1152‑FBGA (35×35) package for surface‑mount assembly and offers 552 device I/Os. It is a commercial‑grade part specified for operation from 0 °C to 85 °C and a core supply range of 870 mV to 930 mV.

Key Features

• Core Logic  420,000 logic elements for high-density logic implementation and complex finite-state machines or datapaths.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM to support FIFOs, buffers, and on-chip data storage.
• I/O Capacity  552 device I/Os to enable large, multi‑lane interfaces, parallel sensors, and broad connectivity options.
• Package & Mounting  1152‑FBGA (35×35) package case (1152‑BBGA, FCBGA) in a surface‑mount form factor for compact board integration.
• Power  Core supply specified from 870 mV to 930 mV for predictable power planning and supply rail design.
• Operating Range  Commercial grade operation from 0 °C to 85 °C suitable for controlled‑environment electronics.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking  Large logic capacity and extensive I/O make the device suitable for packet processing, protocol bridging, and multi‑lane interface aggregation.
• Data Center Acceleration  Dense logic and on‑chip memory enable custom compute kernels and hardware offload functions.
• Signal Processing  On‑chip RAM and abundant logic support real‑time DSP, filtering, and multichannel data acquisition tasks.
• Prototyping and System Integration  High I/O count and a compact BGA package facilitate integration into evaluation platforms and prototype systems requiring many external interfaces.

Unique Advantages

• High logic density: 420,000 logic elements provide the headroom needed for complex designs without immediate migration to larger devices.
• Substantial embedded memory: Approximately 38 Mbits of RAM reduces dependency on external memory for many buffering and state‑holding tasks.
• Extensive I/O availability: 552 I/Os simplify board-level routing and allow direct connections to multiple high‑speed peripherals or parallel interfaces.
• Compact BGA footprint: 1152‑FBGA (35×35) package enables a dense, manufacturable solution for space‑constrained PCBs.
• Commercial temperature and RoHS compliance: Device grading and environmental compliance support mainstream electronic product development and deployment.

Why Choose 5SGXEA4H1F35C1G?

The 5SGXEA4H1F35C1G delivers a balanced combination of high logic capacity, significant on‑chip memory, and a large I/O count in a compact BGA package, making it well suited for demanding data‑path and processing applications in commercial products. Its defined operating voltage window and commercial temperature rating simplify system power design and thermal planning.

Designed as part of the Stratix V GX family, this device fits design flows that require large FPGA resources and broad connectivity while remaining within commercial environmental constraints. It offers a scalable option for teams developing networking, signal processing, and compute‑acceleration solutions that need substantial on‑chip integration and predictable electrical characteristics.

Request a quote or submit an inquiry to discuss availability, lead times, and how the 5SGXEA4H1F35C1G can meet your project requirements.