5SGXEA4H1F35C1N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

Quantity 705 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4H1F35C1N – Stratix V GX FPGA, 1152‑BBGA

The 5SGXEA4H1F35C1N is a Stratix® V GX field-programmable gate array (FPGA) in a 1152‑BBGA package designed for high-density programmable logic applications. It combines substantial logic capacity, on-chip memory, and a large I/O count in a commercial-grade surface-mount FCBGA footprint.

As a member of the Stratix V GX family, this device aligns with the series-level characteristics documented in the Stratix V device datasheet, including configurable core and transceiver speed grades for designers who require scalable performance and integration.

Key Features

  • Logic Capacity — Approximately 420,000 logic elements and 158,500 logic array blocks provide the density needed for complex digital designs and high-level integration.
  • Embedded Memory — Approximately 38 Mbits of on-chip RAM for buffering, algorithm implementation, and state storage without external memory in many use cases.
  • I/O Resources — 552 dedicated I/O pins to support wide external connectivity and high-channel-count interfaces directly from the FPGA package.
  • Package & Mounting — 1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA (35×35), optimized for surface-mount assembly and compact board designs.
  • Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power architecture requirements.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
  • Standards Compliance — RoHS compliant, supporting environmental and regulatory needs for lead‑free assembly.

Unique Advantages

  • High integration density: Large logic and memory resources enable consolidation of multiple functions into a single device, reducing system BOM and board area.
  • Extensive external connectivity: 552 I/Os allow flexible interfacing to a wide range of peripherals and high-channel-count systems without additional I/O expanders.
  • Compact package: 1152‑BBGA (35×35) FCBGA package provides a space-efficient footprint for high-performance FPGA capability on compact PCBs.
  • Design scalability: As a Stratix V GX device, it aligns with the family-level options for core and transceiver speed grades documented in the device datasheet, enabling designers to target performance/price tradeoffs within the same architecture.
  • Commercial operating range: Specified 0 °C to 85 °C operating temperature and RoHS compliance simplify selection for mainstream commercial products.

Why Choose 5SGXEA4H1F35C1N?

The 5SGXEA4H1F35C1N is positioned for designs that require substantial programmable logic, abundant on-chip memory, and a high I/O count in a compact, surface-mount FCBGA package. Its combination of approximately 420,000 logic elements, ~38 Mbits of embedded RAM, and 552 I/Os makes it suitable where integration and connectivity are primary concerns.

Choosing this Stratix V GX device provides a pathway to scalable designs within the Stratix V family while maintaining commercial-grade operational requirements and RoHS compliance for mainstream production environments.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA4H1F35C1N.

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