5SGXEA4H1F35C2G

The 5SGXEA4H1F35C2G is a Stratix V GX family FPGA from Intel, delivered in a 1152-ball BGA FCBGA package. This high-capacity programmable logic device provides substantial on-chip resources and a broad I/O complement for complex digital designs.

Key on-chip resources include 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 552 user I/Os. The device is specified for commercial temperature operation (0°C to 85°C) and RoHS compliance.

Key Features

• Core Logic Capacity — 420,000 logic elements for implementing large-scale digital logic and custom accelerators.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
• I/O Count — 552 user I/Os to interface with multiple peripherals, high-pin-count connectors, and complex board-level systems.
• Package & Mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount device suitable for standard PCB assembly.
• Power Envelope — Core supply specified from 870 mV to 930 mV, enabling integration into tightly specified power domains.
• Temperature Grade — Commercial grade with an operating range of 0°C to 85°C.
• Standards Compliance — RoHS compliant.
• Documentation Coverage — Electrical and switching characteristics, including transceiver and I/O timing details, are provided in the Stratix V device datasheet.

Typical Applications

• High‑density digital processing — Implement wide datapaths, complex state machines, and custom hardware accelerators using the large logic and memory resources.
• Multi‑interface systems — Support systems that require numerous external connections and signal interfaces with 552 available I/Os.
• On‑chip buffering and packet handling — Use the substantial embedded RAM for packet buffering, FIFOs, and stream processing tasks.

Unique Advantages

• High logic density: 420,000 logic elements provide the capacity to consolidate multiple functions onto a single FPGA, reducing system complexity.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM minimizes external memory requirements for many applications.
• Extensive I/O support: 552 I/Os deliver flexible connectivity for complex board-level designs and multiple peripheral interfaces.
• Compact BGA packaging: 1152-ball FCBGA/FBGA package offers a high pin count in a standard surface-mount form factor for dense PCB implementations.
• Commercial temperature rating: Rated for 0°C to 85°C operation for standard commercial deployments.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA4H1F35C2G?

The 5SGXEA4H1F35C2G positions itself as a high-capacity member of the Stratix V GX family, delivering a blend of substantial logic resources, large on-chip memory, and broad I/O capability in a compact BGA package. It is suited to designers who need to integrate multiple complex functions into a single programmable device while maintaining a controlled power domain and commercial-temperature operation.

Backed by the Stratix V device documentation covering electrical, switching, and transceiver characteristics, this device is a practical choice for projects that require scalable logic density, embedded memory, and extensive external interfacing while meeting RoHS requirements.

Request a quote or submit an inquiry to learn more about pricing, availability, and how the 5SGXEA4H1F35C2G can fit into your next design.