5SGXEA4H1F35C2N

The 5SGXEA4H1F35C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1152-ball BGA (FCBGA) package. It provides a high logic capacity device with significant on-chip memory and a large I/O count suitable for compact, board-level integration.

Designed as a commercial-grade device, this FPGA targets applications that require large programmable logic resources, substantial embedded RAM, and dense I/O, while operating within a 0 °C to 85 °C temperature range and an 870 mV to 930 mV supply window.

Key Features

• Core logic capacity  Provides 420,000 logic elements to implement large digital designs and complex logic functions.
• Embedded memory  Approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) for data buffering, packet processing, and state storage.
• I/O density  Up to 552 device I/Os to support wide parallel interfaces and multiple external peripherals.
• Package & mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type supports compact PCB layouts.
• Power  Device voltage supply range is 870 mV to 930 mV, enabling defined core power planning and supply design.
• Commercial grade & temperature  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Standards compliance  RoHS compliant.

Typical Applications

• High-density logic implementations  For designs requiring substantial programmable logic capacity enabled by 420,000 logic elements.
• Memory-intensive data processing  Uses approximately 37.9 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
• High I/O interface boards  Suited to systems that need up to 552 I/Os for parallel interfaces or multi‑lane connectivity.
• Compact, surface-mount designs  1152-ball BGA package supports dense, space-constrained PCB layouts.

Unique Advantages

• Large programmable resource pool: With 420,000 logic elements, the device enables complex logic partitioning and large-scale integration on a single FPGA.
• Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory reduces the need for external RAM in many data-path and buffering use cases.
• High I/O count: 552 I/Os allow direct connection to multiple peripherals and wide external interfaces without extensive external multiplexing.
• Compact system integration: 1152-BBGA (35×35) packaging and surface-mount mounting facilitate compact, manufacturable board layouts.
• Defined power envelope: 870 mV–930 mV supply range provides clear parameters for power-supply design and thermal planning.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics environments.

Why Choose 5SGXEA4H1F35C2N?

The 5SGXEA4H1F35C2N combines high logic density, extensive embedded RAM, and a large I/O complement in a compact 1152-ball BGA package, making it well suited for complex digital designs that require significant on-chip resources and board-level integration. Its commercial-grade temperature rating and RoHS compliance align with standard electronics manufacturing and deployment requirements.

This part is appropriate for development teams and procurement groups targeting scalable FPGA-based solutions where logic capacity, embedded memory, and I/O density are primary selection criteria. The clear electrical and package specifications simplify system-level power, thermal, and PCB planning.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for part number 5SGXEA4H1F35C2N.