5SGXEA4H2F35C1N

The 5SGXEA4H2F35C1N is a Stratix V GX family FPGA from Intel, offering a high logic-density programmable fabric in a compact FCBGA/FBGA package. It combines large on-chip memory, extensive I/O, and the Stratix V GX family’s transceiver-focused architecture for designs that require dense logic, embedded RAM, and high-speed serial I/O capability.

Targeted at commercial-grade applications, this device delivers 420,000 logic elements, approximately 38 Mbits of embedded memory, and 552 user I/Os, while operating within a core voltage range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 420,000 logic elements for high-density digital design and system integration.
• Embedded Memory Approximately 38 Mbits of on-chip RAM (37,888,000 bits) to support memory-intensive functions and buffering.
• I/O Capacity 552 general-purpose I/Os to interface with wide buses, peripherals, and external devices.
• Transceiver Family Capabilities Part of the Stratix V GX family, which the datasheet documents with GX transceiver speed grades up to 14.1 Gbps (family-level characteristic).
• Package and Mounting 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount device for PCB integration.
• Power Core supply voltage range: 870 mV to 930 mV for the programmable core.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation and designated as Commercial grade.
• Compliance RoHS compliant.

Typical Applications

• High-speed communications Suitable for systems leveraging the Stratix V GX family’s transceiver capabilities for high-speed serial links (family-level transceiver speed grades documented in the datasheet).
• High-density logic and signal processing Large logic element count and substantial embedded memory support complex digital processing and integration of multiple functions on a single device.
• I/O-rich systems The 552 I/Os and 1152-ball BGA package make this FPGA a fit for designs requiring extensive external connectivity and dense board-level routing.
• Commercial embedded systems Commercial temperature rating and RoHS compliance align the device with standard commercial embedded applications.

Unique Advantages

• High logic density: 420,000 logic elements allow consolidation of complex logic and multiple subsystems into a single FPGA, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM enables local buffering, large FIFOs, and memory-intensive algorithms without relying on external RAM.
• Extensive I/O resources: 552 I/Os support broad peripheral connectivity and parallel interfaces, giving designers flexibility in system partitioning.
• Compact BGA packaging: 1152-ball FCBGA/FBGA packaging in a 35×35 footprint facilitates dense board-level integration while supporting surface-mount assembly.
• Low-voltage core operation: Core supply range of 870 mV–930 mV supports modern low-voltage FPGA power domains and system power management strategies.
• Commercial readiness and compliance: Commercial temperature rating (0 °C–85 °C) and RoHS compliance simplify adoption in standard commercial product lines.

Why Choose 5SGXEA4H2F35C1N?

The 5SGXEA4H2F35C1N positions itself as a high-density, I/O-capable Stratix V GX FPGA for commercial applications that need substantial logic resources, embedded memory, and the family-level capability for high-speed serial interfaces. Its combination of 420,000 logic elements, approximately 38 Mbits of RAM, and 552 I/Os in a 1152-ball BGA package provides a strong platform for consolidating complex digital functions and supporting memory- and I/O-intensive designs.

Designed for commercial embedded systems, this device offers predictable operating characteristics (870 mV–930 mV core supply, 0 °C–85 °C operating temperature) and RoHS compliance, delivering a pragmatic balance of performance, integration, and manufacturability for teams building advanced FPGA-based products.

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