5SGXEA4H2F35C2G

The 5SGXEA4H2F35C2G is a Stratix® V GX field programmable gate array manufactured by Intel. This surface-mount FCBGA device delivers high logic capacity and on-chip memory in a 1152-ball FCBGA package for compact, high-density designs.

Designed for commercial-grade applications, the device provides a large number of logic elements, substantial embedded RAM, and extensive I/O resources to support complex programmable logic implementations.

Key Features

• Logic Capacity  Provides 420,000 logic elements for implementing large-scale programmable designs.
• Embedded Memory  Includes approximately 37.9 Mbits of on-chip RAM to support state, buffering, and memory-intensive functions.
• I/O Resources  Offers 552 I/O pins to support broad external connectivity and high-pin-count interfaces.
• Power  Core supply voltage range of 870 mV to 930 mV for operation with low-voltage power domains.
• Package & Mounting  Available in a 1152-BBGA (FCBGA) package, supplier package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement complex digital logic that requires a large number of logic elements and embedded RAM.
• Custom hardware acceleration  Accelerate compute- or data-heavy functions using on-chip resources and extensive I/O.
• System integration and prototyping  Integrate multiple functions into a single FPGA for system prototyping and validation on compact PCBs.
• High-pin-count interface designs  Leverage 552 I/Os to connect with multiple peripherals, memory interfaces, or mezzanine modules.

Unique Advantages

• High logic density: 420,000 logic elements enable complex designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces the need for external memory in many designs.
• Extensive I/O: 552 I/O pins provide flexibility for high-bandwidth and multi-interface applications.
• Compact FCBGA package: 1152-ball FCBGA (35×35) delivers high integration density in a surface-mount form factor.
• Low-voltage core operation: 870 mV–930 mV core supply supports modern low-voltage system architectures.
• Commercial temperature range: Rated for 0 °C to 85 °C operation for standard commercial deployments.

Why Choose 5SGXEA4H2F35C2G?

The 5SGXEA4H2F35C2G delivers a combination of high logic capacity, substantial embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for commercial designs that require dense programmable logic and integrated RAM. Its low-voltage core range and surface-mount form factor support modern board-level power architectures and compact PCB layouts.

This Intel-manufactured Stratix V GX device is targeted at developers and teams implementing complex programmable systems where on-chip resources and high pin-count connectivity reduce external component count and simplify system integration.

Request a quote or submit an inquiry for part number 5SGXEA4H2F35C2G to get pricing and availability for your project needs.