5SGXEA4H2F35C1G

The 5SGXEA4H2F35C1G is a Stratix® V GX field programmable gate array (FPGA) offered in a commercial temperature grade. This high-density programmable device integrates 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM to support complex digital designs.

Packaged in a 1152-ball FCBGA (1152-BBGA / 1152-FBGA 35×35) with surface-mount mounting, the device is built for commercial embedded applications that require large logic capacity, abundant I/O, and low-voltage core operation.

Key Features

• Core Logic Capacity — 420,000 logic elements to implement large-scale custom digital functions and parallel processing architectures.
• Logic Array Blocks (LABs) — 158,500 logic array blocks (LABs) for structured logic partitioning and resource organization.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for buffering, FIFOs, and DSP data storage.
• High I/O Count — 552 I/Os to connect extensive peripheral sets, parallel buses, and multi-channel interfaces.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier package: 1152-FBGA 35×35) with surface-mount mounting for compact board-level integration.
• Supply Voltage — Core supply range 870 mV to 930 mV to match low-voltage power domains.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for global commercial product assembly requirements.

Typical Applications

• Commercial Embedded Systems — Implement large custom logic and control functions for commercial electronic products within the 0 °C to 85 °C operating window.
• Data Acquisition & Instrumentation — Use the high I/O count and large on-chip RAM for multi-channel data capture, preprocessing, and buffering.
• DSP and Signal Processing — Leverage 420,000 logic elements and substantial embedded memory for compute-intensive, parallelizable digital signal tasks.

Unique Advantages

• High Logic Integration: With 420,000 logic elements, designers can consolidate complex subsystems into a single device and reduce external components.
• Large On-Chip Memory: Approximately 37.9 Mbits of RAM supports deep buffering and data-path acceleration without relying on external memory.
• Extensive I/O Count: 552 I/Os provide flexibility for interfacing to multiple peripherals, sensors, or parallel buses.
• Compact FCBGA Package: The 1152-ball FCBGA (35×35) provides a dense pinout for high-pin-count designs while maintaining a compact footprint.
• Low-Voltage Core Support: Core supply range of 870–930 mV aligns with low-voltage system architectures to help optimize overall board power design.
• Commercial-Grade and RoHS Compliant: Designed for commercial application environments and meets RoHS environmental requirements.

Why Choose 5SGXEA4H2F35C1G?

The 5SGXEA4H2F35C1G balances high logic density, significant embedded memory, and a very high I/O count in a compact FCBGA package, providing a strong foundation for complex commercial designs where integration and board-level density matter. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of non-industrial embedded applications.

Designers targeting large-scale programmable logic implementations—such as multi-channel data paths, custom processing engines, or I/O-dense platforms—will find the combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 552 I/Os advantageous for reducing external components and simplifying system architecture.

Request a quote or submit an inquiry to check availability and lead times for the 5SGXEA4H2F35C1G Stratix® V GX FPGA. Technical sales can provide pricing, ordering, and supply information tailored to your project needs.