5SGXEA4H2F35C2L

The 5SGXEA4H2F35C2L is a Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA FCBGA package. Designed for high-density programmable logic integration, this commercial-grade device delivers large on-chip memory, extensive I/O capability, and core voltage operation optimized for Stratix V GX devices.

This device is suited for applications that require substantial logic capacity and embedded memory within a surface-mount BGA footprint, while operating within a commercial temperature range.

Key Features

• High Logic Density  420,000 logic elements provide capacity for complex digital designs and high-function integration.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM supports large buffering, state storage, and memory-mapped logic functions.
• Extensive I/O  552 general-purpose I/Os enable broad peripheral connectivity and high-pin-count interfaces.
• Core Voltage  Operates with a core supply range of 820 mV to 880 mV, matching Stratix V GX device requirements.
• Package and Mounting  Supplied in a 1152-BBGA (FCBGA) surface-mount package; supplier package listed as 1152-FBGA (35×35) for compact board-level integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial embedded and communications systems.
• Standards Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.

Typical Applications

• Network Infrastructure: Use the device’s large logic capacity and abundant I/O to implement packet processing, switching fabric, or custom network acceleration functions.
• High-Performance Embedded Systems: Implement compute-heavy control, protocol offload, or data-path logic where on-chip RAM and dense logic reduce external memory dependence.
• Signal Processing and Compute Engines: Deploy wide datapaths and buffering for DSP-like workloads that benefit from large embedded memory and many I/Os.

Unique Advantages

• Substantial Logic Resources: 420,000 logic elements enable consolidation of multiple subsystems into a single FPGA, simplifying BOM and board complexity.
• Significant On-Chip Memory: Approximately 38 Mbits of embedded RAM reduce the need for external memory, improving latency and board-level cost.
• High I/O Count: 552 I/Os support dense external interfacing for multi-channel designs, diverse peripherals, and complex routing requirements.
• Compact BGA Packaging: The 1152-BBGA (1152-FBGA supplier outline) package provides high pin density in a surface-mount form factor suitable for modern PCBs.
• Commercial-Grade Operating Range: Specified for 0 °C to 85 °C operation to match a wide set of commercial embedded applications.
• Regulatory Readiness: RoHS compliance supports lead-free manufacturing flows and regulatory needs for commercial products.

Why Choose 5SGXEA4H2F35C2L?

The 5SGXEA4H2F35C2L positions itself as a high-density Stratix V GX FPGA option for commercial embedded and networking designs that require significant logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its specified core voltage range and commercial temperature rating align with Stratix V GX device requirements, enabling integration into designs that balance performance with board-level integration constraints.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with substantial embedded memory and I/O headroom will find this device suitable for consolidating complex functions onto a single programmable device while leveraging Intel’s Stratix V device architecture and documentation.

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