5SGXEA4H2F35C3G

The 5SGXEA4H2F35C3G is a Stratix® V GX field programmable gate array (FPGA) in a commercial temperature grade. It delivers high logic capacity, substantial on‑chip memory, and a large I/O count in a 1152‑ball FBGA package suitable for surface‑mount assembly.

Designed where dense programmable logic, abundant embedded memory, and extensive I/O are required, this device targets complex digital designs that benefit from high integration and flexible system partitioning.

Key Features

• Core & Logic Provides 420,000 logic elements for implementing large, multi‑module FPGA designs.
• Embedded Memory Approximately 37.9 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive logic functions.
• I/O Density 552 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Transceiver & Series Information Part of the Stratix V GX family, which is offered with dedicated transceiver speed grades for high‑speed serial channel support.
• Package & Mounting 1152‑BBGA (FCBGA) / supplier package 1152‑FBGA (35×35) in a surface‑mount form factor for high‑pin‑count, compact board designs.
• Power Core voltage supply range: 0.820 V to 0.880 V, enabling defined power‑domain integration in systems with low‑voltage FPGA cores.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High‑density digital processing Implement large custom logic fabrics and algorithm acceleration using the device’s 420,000 logic elements and substantial embedded memory.
• Complex I/O subsystems Support wide parallel buses, multiple peripherals, and board‑level interfaces with 552 user I/Os.
• High‑speed serial link designs Leverage the Stratix V GX family’s transceiver offering to integrate serial channels for data communication and interfacing.

Unique Advantages

• High logic capacity: 420,000 logic elements enable consolidation of large, multi‑function designs into a single device, reducing board count.
• Substantial on‑chip memory: Approximately 37.9 Mbits of embedded RAM supports buffering and state storage without external memory.
• Extensive I/O availability: 552 I/Os allow flexible interfacing to a variety of peripherals and system modules.
• Compact high‑pin‑count package: 1152‑FBGA (35×35) offers a balance of signal density and PCB area efficiency for surface‑mount applications.
• Defined power domain: Core supply between 0.820 V and 0.880 V supports predictable integration and power budgeting.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial environments.

Why Choose 5SGXEA4H2F35C3G?

The 5SGXEA4H2F35C3G positions itself for system designers needing a high‑capacity Stratix V GX FPGA with a large complement of I/O and embedded memory in a compact FBGA package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on‑chip RAM, and 552 I/Os supports consolidation of complex functions while maintaining board‑level flexibility.

For commercial applications that require high integration, well‑defined core power, and a high‑pin‑count surface‑mount package, this device provides a verifiable, specification‑driven platform to build robust FPGA‑based systems.

Request a quote or submit an inquiry to purchase this Stratix V GX FPGA and receive pricing and availability details for your design needs.