5SGXEA4H2F35I2G

The 5SGXEA4H2F35I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering high-density programmable logic and embedded memory in a 1152‑BBGA FCBGA package. It integrates 420,000 logic elements and approximately 37.9 Mbits of on‑chip RAM to address complex digital processing, protocol offload, and system‑level integration tasks.

Designed for industrial environments, this device combines broad I/O resources and a tightly specified core voltage range to support robust, high‑performance designs that require large logic capacity and substantial embedded memory.

Key Features

• Core Logic  420,000 logic elements provide a large programmable fabric for complex state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for FIFOs, buffers, and on‑chip data structures.
• I/O and Connectivity  552 user I/O pins enable extensive peripheral and high‑pin‑count system interfaces.
• Power and Supply  Specified core supply range of 870 mV–930 mV to support defined power budgeting and supply design.
• Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount mounting type.
• Operating Range and Grade  Industrial grade device rated for operation from −40 °C to 100 °C for use in temperature‑demanding applications.
• Standards Compliance  RoHS compliant.
• Family Characteristics  As a Stratix V GX device, family documentation describes GX transceiver and speed‑grade options for high‑performance serial connectivity (refer to family datasheet for full transceiver specifications).

Typical Applications

• Network and Telecom Processing  Large logic capacity and embedded RAM make this FPGA suitable for packet processing, protocol engines, and line‑rate offload functions.
• High‑Performance Acceleration  Use the dense logic array and embedded memory for custom compute accelerators, DSP pipelines, and hardware‑accelerated algorithms.
• Industrial Control and Automation  Industrial temperature rating and extensive I/O support robust control, signal conditioning, and interface bridging in factory and process automation.
• System Prototyping and Integration  High logic density and broad I/O enable consolidation of multiple functions onto a single programmable device for board‑level system integration.

Unique Advantages

• High Logic Density: 420,000 logic elements allow integration of complex logic and multiple subsystems on a single device, reducing component count.
• Substantial On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and on‑chip data structures without external memory dependence.
• Extensive I/O Count: 552 I/O pins provide flexibility for wide parallel interfaces and multiple serial/peripheral connections.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C addresses deployments where temperature robustness is required.
• Compact FCBGA Packaging: 1152‑BBGA/1152‑FBGA (35×35) package format supports high‑pin‑count implementations in a surface‑mount form factor.
• RoHS Compliant: Conforms to RoHS requirements for environmental compliance in commercial and industrial products.

Why Choose 5SGXEA4H2F35I2G?

The 5SGXEA4H2F35I2G positions itself where high logic capacity, significant embedded memory, and broad I/O converge in an industrially rated FPGA. Its combination of 420,000 logic elements, nearly 38 Mbits of on‑chip RAM, and 552 I/Os enables designers to consolidate functions, accelerate algorithms, and implement complex protocol processing within a single programmable device.

This device is well suited for teams building performance‑oriented, temperature‑tolerant systems that benefit from a scalable FPGA architecture and a compact FCBGA package. Reference family documentation for Stratix V GX speed‑grade and transceiver options when planning designs that require high‑speed serial interfaces.

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