5SGXEA4H2F35I2N

The 5SGXEA4H2F35I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC by Intel, supplied in a 1152-BBGA FCBGA package. It provides a large programmable fabric with significant on-chip memory and a high I/O count, making it suitable for dense, I/O-rich designs.

Key attributes include 420,000 logic elements, approximately 38 Mbits of embedded RAM, 552 general-purpose I/Os, an industrial operating temperature range, and a specified core supply range of 870 mV to 930 mV—attributes that support complex system integration and robust operation across temperature extremes.

Key Features

• Logic Capacity  Provides 420,000 logic elements to implement large FPGA designs and complex custom logic functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM (37,888,000 bits) for buffering, frame storage, and on-die data structures.
• I/O Count  552 I/Os to support wide parallel interfaces, large bus systems, and dense external connectivity.
• Power and Core Voltage  Specified supply range of 870 mV to 930 mV for the device core, allowing precise power budgeting for system designs.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA, 35 × 35 mm) in a surface-mount configuration for board-level compatibility with high-density assemblies.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, enabling use in extended-temperature environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density FPGA systems  Implement large-scale custom logic and state machines using the 420,000 logic elements and substantial embedded RAM.
• Data-path and buffering  Use the approximately 38 Mbits of on-chip memory for packet buffering, line-rate FIFOs, and temporary storage in data-flow architectures.
• Multi‑interface platforms  Leverage 552 I/Os to connect to multiple external peripherals, parallel buses, or high-pin-count mezzanine modules.
• Industrial and harsh‑environment equipment  Industrial temperature rating (−40 °C to 100 °C) supports deployment in temperature-challenging applications.

Unique Advantages

• Large programmable fabric: 420,000 logic elements enable highly integrated custom logic, reducing the need for multiple discrete ASICs or FPGAs.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM simplifies data path design and reduces external memory dependency.
• High I/O density: 552 I/Os facilitate complex interfacing and multiple concurrent external connections without heavy PCB routing compromises.
• Industrial temperature rating: Operation from −40 °C to 100 °C provides robustness for demanding environments and extended-temperature deployments.
• Compact, high‑pin package: 1152-BBGA (35 × 35 mm) offers a high I/O/pin count footprint in a surface-mount form factor for space-constrained boards.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA4H2F35I2N?

The 5SGXEA4H2F35I2N positions itself as a high-density Stratix V GX FPGA option where large logic capacity, substantial embedded memory, and broad I/O counts are required. Its industrial temperature rating and defined core supply range aid system-level reliability and power planning.

This device is appropriate for engineering teams building complex, I/O-intensive systems that need on-chip memory and significant programmable logic in a single, surface-mount package. The combination of logic resources, memory, and I/O density provides scalability for evolving designs and helps consolidate functionality to simplify board-level integration.

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