5SGXEA4H2F35I3L

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

Quantity 824 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4H2F35I3L – Stratix V GX FPGA, 420,000 Logic Elements, 552 I/Os

The 5SGXEA4H2F35I3L is a Stratix V GX field-programmable gate array (FPGA) designed for high-density, programmable digital logic. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex system designs that require significant routing and local storage.

Built as an industrial-grade device, this FPGA is intended for applications that demand extended temperature operation and high integration, while providing deterministic, reprogrammable hardware resources for advanced digital processing and interfacing tasks.

Key Features

  • Logic Capacity  420,000 logic elements for implementing large, complex designs and multi-function hardware accelerators.
  • Embedded Memory  Approximately 38 Mbits of on-chip RAM to support packet buffering, large lookup tables, and local data storage.
  • I/O Resources  552 user I/Os to enable extensive external interfacing, parallel buses, and complex board-level connectivity.
  • Power and Core Voltage  Core voltage supply range of 820 mV to 880 mV, allowing precise power-domain design and margining.
  • Package and Mounting  1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount format for high-density PCB integration.
  • Industrial Grade Temperature Range  Rated for operation from –40°C to 100°C to meet extended-environment deployment requirements.
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • High-density digital processing  Implement large combinational and sequential logic blocks, hardware accelerators, and custom compute pipelines using the device’s extensive logic resources.
  • Memory-intensive designs  On-chip RAM supports buffering, FIFOs, and local data storage for streaming and packet-processing applications.
  • Complex interfacing and routing  With 552 I/Os, the FPGA is well suited for designs that require multiple external buses, sensors, or parallel interfaces.
  • Industrial systems  Industrial temperature rating enables deployment in equipment and environments that require extended operating temperature range.

Unique Advantages

  • High integration density: The 420,000 logic elements reduce the need for multiple discrete devices by consolidating logic into a single FPGA.
  • Substantial embedded memory: Approximately 38 Mbits of RAM enables extensive on-chip buffering and data-path optimization without external memory in many use cases.
  • Extensive I/O count: 552 I/Os provide flexibility for interfacing to numerous peripherals, sensors, and high-pin-count daughtercards.
  • Industrial temperature rating: –40°C to 100°C supports designs intended for extended-environment operation.
  • Compact, high-density packaging: 1152-FBGA (35×35) package supports dense PCB layouts and high-pin routing capability in a surface-mount form factor.
  • Controlled core voltage range: 820–880 mV supply range assists in precise power architecture design and validation.

Why Choose 5SGXEA4H2F35I3L?

The 5SGXEA4H2F35I3L delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA. This balance of resources suits engineers designing feature-rich, tightly integrated hardware platforms that require on-chip compute, buffering, and extensive external interfacing while operating across extended temperature ranges.

Choose this part for projects where consolidation of functionality, flexible reprogrammability, and robust environmental tolerance are key design drivers. The device’s specifications provide a clear foundation for scalable, long-term deployments in demanding embedded and industrial systems.

Request a quote or submit a purchase inquiry for part number 5SGXEA4H2F35I3L to receive availability and pricing information tailored to your project needs.

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