5SGXEA4H2F35I3LN

The 5SGXEA4H2F35I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers very large programmable logic capacity, substantial on-chip memory, and a high I/O count in a compact 1152‑FBGA package suitable for surface‑mount board designs.

This industrial‑grade device is designed for designs that require significant logic resources, abundant embedded RAM, and robust operating range, with documented electrical and switching characteristics provided in the Stratix V device datasheet.

Key Features

• Logic Capacity  Approximately 420,000 logic elements to implement large-scale combinational and sequential logic.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for data buffering, FIFOs, and embedded storage.
• I/O Density  552 user I/O pins to support high pin‑count interfacing and multiple peripheral connections.
• Package & Mounting  1152‑BBGA / 1152‑FBGA (35×35) package; surface‑mount mounting type for compact, high‑density board layouts.
• Power  Core supply range of 820 mV to 880 mV, suitable for systems designed around low‑voltage FPGA cores.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS requirements.
• Family-Level Transceiver Options (Series Datasheet)  The Stratix V GX family datasheet documents multiple transceiver speed grades for GX devices (series information provided in the device datasheet).

Typical Applications

• High‑density programmable logic designs  Implement complex digital systems that require large logic capacity and significant embedded RAM.
• I/O‑intensive interfaces  Use the 552 I/O pins for designs needing many parallel or mixed signaling interfaces.
• Industrial systems  Industrial‑grade temperature range (−40 °C to 100 °C) and RoHS compliance make this device suitable for industrial instrumentation and control electronics.
• Compact, high‑pin‑count boards  The 1152‑FBGA (35×35) surface‑mount package supports compact, high‑density PCB implementations.

Unique Advantages

• High programmable density: Approximately 420,000 logic elements provide the capacity to consolidate complex functionality into a single device, reducing BOM count.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM supports large buffering and data‑path requirements without external memory.
• Large I/O footprint: 552 I/O pins enable extensive peripheral integration and flexible system interfacing.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
• Compact, high‑pin package: 1152‑FBGA (35×35) enables high interconnect density while maintaining a surface‑mount form factor.
• Low‑voltage core operation: Core supply range of 820 mV–880 mV aligns with modern low‑voltage FPGA power architectures.

Why Choose 5SGXEA4H2F35I3LN?

5SGXEA4H2F35I3LN brings the Stratix V GX family’s documented electrical and switching characteristics into a single, industrial‑grade FPGA package. With approximately 420,000 logic elements, roughly 37.9 Mbits of embedded memory, and 552 I/O pins, it is positioned for engineers who need high integration density, extensive on‑chip resources, and a wide operating temperature range.

This device is appropriate for designs that require consolidation of large logic functions, substantial embedded storage, and dense I/O in a surface‑mount 1152‑FBGA package. Detailed device electrical and transceiver characteristics are available in the Stratix V device datasheet to support design validation and system integration.

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