5SGXEA4H3F35C2L

The 5SGXEA4H3F35C2L is a Stratix V GX family FPGA offered in a 1152-BBGA (FCBGA) package. It provides a high density of programmable logic, embedded memory, and a large number of I/O to support complex digital designs that require substantial on-chip resources and high‑speed I/O capability.

Device documentation for the Stratix V family describes electrical and switching characteristics including transceiver specifications, core and periphery performance, and I/O timing. This part is specified for commercial-grade operation.

Key Features

• Logic Capacity  Approximately 420,000 logic elements for implementing large-scale digital designs and complex state machines.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffers, FIFOs, and memory‑intensive logic functions.
• I/O Density  552 user I/O pins to interface with multiple peripherals, busses, and high-pin-count systems.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35 mm) in a surface-mount package suitable for board-level integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
• Temperature Grade  Commercial operating temperature range from 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant for regulatory and manufacturing alignment.
• Family-Level Documentation  Stratix V device datasheet covers electrical characteristics, switching behavior, transceiver specifications, and I/O timing for detailed design reference.

Typical Applications

• High-speed I/O and Protocol Bridging  Use the device’s extensive I/O and family-level transceiver documentation to implement interfaces and protocol converters.
• Compute and Logic Acceleration  Leverage the large logic element count and embedded memory for hardware acceleration of compute‑intensive functions.
• Prototype and Development Platforms  High resource density and abundant I/O make this part suitable for advanced FPGA-based prototypes and evaluation platforms.

Unique Advantages

• High Logic Integration: Approximately 420,000 logic elements enable consolidation of complex subsystems into a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 38 Mbits of embedded RAM supports large buffers and internal data storage without external memory.
• Extensive I/O Count: 552 I/Os provide flexibility for multi-channel interfaces and high‑pin-count connectivity requirements.
• Compact, High-Density Package: 1152-FBGA (35×35 mm) package offers a balance of pin count and board footprint for dense system designs.
• Commercial Operating Range: Rated 0 °C to 85 °C to match standard commercial application environments.
• Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing processes.

Why Choose 5SGXEA4H3F35C2L?

The 5SGXEA4H3F35C2L delivers a combination of high logic density, significant embedded memory, and a large number of I/Os in a compact surface-mount FBGA package. It is positioned for designs that require substantial on-chip resources and precise power/thermal planning within commercial temperature environments.

Engineers choosing this Stratix V GX device can rely on family-level documentation covering electrical characteristics, switching performance, and I/O timing to support detailed design, verification, and system integration.

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