5SGXEA4H2F35I3NCV

The 5SGXEA4H2F35I3NCV is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1152‑BBGA (1152‑FBGA, 35×35) surface-mount package. It delivers high logic density and on-chip memory capacity for demanding digital designs and supports industrial temperature operation.

Key on-chip resources include 420,000 logic elements, approximately 38 Mbits of embedded memory, and 552 I/Os. The device operates from a core supply of 820 mV to 880 mV and is rated for −40 °C to 100 °C.

Key Features

• Logic Capacity  420,000 logic elements for large-scale, high-density FPGA implementations.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage.
• I/O Resources  552 user I/Os to support wide parallel interfaces and complex board-level connectivity.
• Core Voltage  Core supply range of 820 mV to 880 mV for the device core operating conditions.
• Package & Mounting  1152‑BBGA (1152‑FBGA, 35×35) FCBGA package; surface-mount mounting suitable for high-density PCB assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature-demanding environments.
• Standards Compliance  RoHS compliant, meeting common environmental and lead-free requirements.

Typical Applications

• High-speed serial systems  Leverage Stratix V GX transceiver family capabilities and abundant logic for protocol bridging and packet processing.
• Network and telecom infrastructure  Large logic capacity and embedded memory support complex forwarding, buffering, and feature-rich network functions.
• Signal processing and compute acceleration  High logic density and significant on-chip RAM enable real-time data-path processing and algorithm acceleration.
• Industrial control and instrumentation  Industrial temperature rating and extensive I/O count allow deployment in harsh environments and complex control systems.

Unique Advantages

• High integration density: 420,000 logic elements reduce the need for multiple devices and simplify system architecture.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports large buffers and stateful processing without external memory reliance.
• Extensive I/O flexibility: 552 I/Os accommodate diverse interfaces and high pin-count designs.
• Industrial temperature capability: Rated from −40 °C to 100 °C for robust operation in challenging thermal environments.
• Compact, manufacturable package: 1152‑BBGA (35×35) surface-mount package provides a balance of pin count and board footprint for high-density PCBs.
• Regulatory readiness: RoHS compliance simplifies environmental qualification for many markets.

Why Choose 5SGXEA4H2F35I3NCV?

The 5SGXEA4H2F35I3NCV positions itself as a high-capacity Stratix V GX FPGA option for designs requiring substantial logic, abundant embedded RAM, and a large I/O complement within an industrial temperature envelope. Its package and power characteristics make it suitable for compact, high-density boards where on-chip resources and reliability are priorities.

Choose this device when your design demands scalable logic capacity, significant on-chip memory, and industrial-grade operation backed by Intel's Stratix V GX family datasheet specifications.

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