5SGXEA4H3F35C2LG

The 5SGXEA4H3F35C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in a commercial temperature grade. It provides a large logic fabric and substantial on-chip RAM along with a high-pin-count BGA package for dense, high-performance system integration.

Configured as a Stratix V GX device, this FPGA targets designs that require significant logic capacity, abundant embedded memory, and extensive I/O connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 420,000 logic elements (cells) to implement complex digital functions and large custom architectures.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM (37,888,000 bits) for buffering, packet storage, and on-FPGA data structures.
• I/O Resources — 552 I/O pins to support dense peripheral and board-level interfacing requirements.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35 mm) with surface-mount assembly for high-density board layouts.
• Power Supply — Core supply range 820 mV to 880 mV, enabling integration into designs with specified core-voltage rails.
• Temperature Grade — Commercial temperature operation from 0 °C to 85 °C suitable for standard consumer and enterprise environments.
• Compliance — RoHS compliant.
• Family-Level Transceiver Capability — Stratix V GX family documentation describes high-speed transceiver specifications and I/O timing for designs requiring advanced serial connectivity (see device datasheet for details).

Typical Applications

• High‑density digital processing — Use the large logic element count and on-chip RAM to implement complex custom accelerators and signal-processing pipelines.
• Multi‑interface bridging — High I/O count supports designs that aggregate and convert between numerous parallel and serial interfaces.
• Communications and transceiver‑enabled systems — Stratix V GX family transceiver specifications support high-speed serial data paths where on‑chip high-bandwidth links are required.

Unique Advantages

• High logic density: 420,000 logic elements accommodate large, integrated digital designs without offloading to external logic.
• Significant on‑chip RAM: Approximately 38 Mbits of embedded memory reduces external memory dependency for buffering and local data storage.
• Extensive I/O: 552 I/O pins enable complex board-level interfacing and system connectivity in a single device.
• Compact, industry-standard package: 1152‑BBGA (35×35 mm) FCBGA provides a dense footprint for space-constrained, multilayer PCBs using surface-mount assembly.
• Commercial-grade operating range: Specified for 0 °C to 85 °C for designs targeting consumer and enterprise deployments.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly.

Why Choose 5SGXEA4H3F35C2LG?

This Stratix V GX FPGA balances large programmable logic resources and substantial embedded memory with high I/O density and a compact ball-grid package. It is positioned for teams building complex digital systems that require on‑chip capacity for logic and RAM, combined with the ability to support numerous board-level interfaces.

Engineers specifying 5SGXEA4H3F35C2LG benefit from Intel's Stratix V GX family documentation for detailed electrical, switching, and transceiver characteristics—helpful for validating system-level timing and power requirements during design and integration.

Request a quote or submit an inquiry for pricing and availability of 5SGXEA4H3F35C2LG to move your design forward.