5SGXEA4H2F35I3N

The 5SGXEA4H2F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152‑ball FCBGA package. It delivers a high-density programmable logic fabric with extensive on‑chip memory and a large I/O complement for complex system designs.

This device is specified for industrial operation and factory‑mount surface mounting, with a core supply window of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C, making it suitable where wide temperature endurance and high logic capacity are required.

Key Features

• High‑density logic — 420,000 logic elements providing a large programmable fabric for complex algorithms, control logic, and custom accelerators.
• Embedded memory — Approximately 38 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to logic to reduce external memory dependency.
• Extensive I/O — 552 user I/Os to interface with multiple peripherals, buses, and external devices without additional IO expanders.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C to support industrial and other temperature‑demanding deployments.
• Power and core supply — Core voltage specified between 820 mV and 880 mV to match system power budgets and regulators designed for Stratix V devices.
• Package and mounting — 1152‑FBGA (35 × 35 mm) FCBGA surface‑mount package for compact board integration and high pin count routing.
• Standards compliance — RoHS compliant to meet common environmental requirements for electronic assemblies.

Unique Advantages

• Large programmable capacity: 420,000 logic elements give designers the headroom to consolidate multiple functions into a single device, reducing board-level complexity.
• Significant on‑chip memory: Approximately 38 Mbits of embedded RAM enables extensive buffering and local data storage for latency‑sensitive logic.
• High pin‑count connectivity: 552 I/Os simplify integration with dense peripheral sets and multiple external interfaces without external I/O expansion.
• Industrial robustness: Specified operation from –40 °C to 100 °C supports use in harsh or temperature‑variable environments.
• Compact, manufacturable package: 1152‑ball FCBGA (35 × 35 mm) supports high routing density while remaining compatible with standard surface‑mount assembly processes.
• Regulatory alignment: RoHS compliance supports environmentally driven procurement requirements.

Why Choose 5SGXEA4H2F35I3N?

The 5SGXEA4H2F35I3N positions itself as a high‑capacity Stratix V GX FPGA for designs that require large logic count, substantial on‑chip memory, and broad I/O integration within an industrial temperature envelope. Its combination of 420,000 logic elements, approximately 38 Mbits of embedded RAM, and 552 I/Os provides designers with the resources to implement complex, consolidated systems.

With a specified core voltage range and a 1152‑FBGA surface‑mount package, this device is suited for teams focusing on high‑density board designs that demand verified electrical and thermal operating ranges and RoHS conformity.

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