5SGXEA4H2F35I3LG

The 5SGXEA4H2F35I3LG is an industrial-grade Stratix V GX field programmable gate array (FPGA) in a 1152-FBGA (35×35) FCBGA package. It delivers high logic capacity and substantial on-chip RAM for complex, memory‑intensive designs that require abundant I/O connectivity.

Designed for surface-mount assembly and operation across a wide industrial temperature range, this device targets applications that need dense logic integration, large embedded memory, and high pin-count interfacing while maintaining controlled power requirements.

Key Features

• Core Logic Capacity  420,000 logic elements to implement large-scale programmable logic and complex combinational/sequential functions.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, packet processing, and in‑FPGA data storage.
• I/O Density  552 I/O pins providing extensive external interfacing options for multi‑lane systems and dense board-level connectivity.
• Package & Mounting  1152-FBGA (35×35) FCBGA package, surface-mount suitable for compact, high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C to meet demanding environmental requirements.
• Power Supply Range  Core voltage supply specified between 820 mV and 880 mV for precise power design and stability.
• RoHS Compliant  Conforms to RoHS standards for lead‑free manufacturing.

Typical Applications

• High‑density logic integration  Consolidate multiple functions into a single FPGA using the 420,000 logic elements to reduce BOM and board complexity.
• Memory‑intensive processing  Leverage approximately 37.9 Mbits of embedded RAM for on-chip buffering, packet queues, or data-path storage.
• I/O aggregation and bridging  Use the 552 I/Os to aggregate signals, implement protocol bridging, or interface with high-pin-count mezzanine modules.
• Industrial control and automation  Industrial temperature rating and surface-mount package support deployment in factory and process-control equipment.

Unique Advantages

• Large programmable fabric: 420,000 logic elements enable implementation of complex algorithms and extensive parallel processing.
• Substantial embedded memory: Approximately 37.9 Mbits of on-chip RAM reduces reliance on external memory and improves latency for local data storage.
• High I/O count: 552 I/Os simplify board routing for multi-channel and multi-protocol designs.
• Industrial operating range: −40°C to 100°C supports reliable operation in harsh environments.
• Space-efficient FCBGA package: 1152-FBGA (35×35) enables high-density PCB implementations while remaining surface-mount compatible.
• Tightly specified core voltage: 820 mV to 880 mV supply window allows precise power management and integration with regulated power supplies.

Why Choose 5SGXEA4H2F35I3LG?

This Stratix V GX FPGA combines high logic capacity, significant embedded memory, and extensive I/O in a compact FCBGA package rated for industrial temperatures. It is well suited to designs that require on-chip resources to minimize external components, support large data-paths, and provide flexible interfacing on space-constrained PCBs.

Engineers and procurement teams looking for a scalable, high-density FPGA solution will find the 5SGXEA4H2F35I3LG a practical choice for long-term projects that demand robust thermal performance, controlled power requirements, and RoHS compliance.

Request a quote or submit an RFQ today to evaluate the 5SGXEA4H2F35I3LG for your next design.