5SGXEA4H2F35I2WN

The 5SGXEA4H2F35I2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-FBGA (35×35) surface-mount package. This industrial-grade device provides substantial on-chip logic and memory resources for complex programmable logic designs.

Key device characteristics include approximately 420,000 logic elements, approximately 38 Mbits of embedded memory, and 552 general-purpose I/O pins, with a rated operating temperature range of −40 °C to 100 °C and a core supply range of 870 mV to 930 mV.

Key Features

• Logic Capacity  Approximately 420,000 logic elements to implement large-scale combinational and sequential logic structures.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for buffering, state storage, and memory-intensive algorithms.
• I/O  552 I/O pins to support high-pin-count interfacing and dense board-level connectivity.
• Package & Mounting  1152-FBGA (35×35) / 1152-BBGA, FCBGA package in a surface-mount format for compact, high-density board designs.
• Power Supply  Core voltage supply specified between 870 mV and 930 mV for the device core.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance  RoHS compliant.

Unique Advantages

• Large, integrable logic resource: The device’s approximately 420k logic elements enable consolidation of complex functions into a single FPGA, reducing system-level component count.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports deep buffering, lookup tables, and state machines without immediate external memory dependence.
• High I/O density: With 552 I/Os, the part supports multiple parallel interfaces and high channel counts while retaining a compact footprint.
• Industrial temperature qualification: Rated for −40 °C to 100 °C operation, suitable for designs that require extended temperature operation.
• Compact high-pin-count package: The 1152-FBGA (35×35) package delivers a high pin count in a surface-mount form factor for dense board layouts.
• Low-voltage core operation: The defined 870 mV to 930 mV supply range provides a clear power domain specification for system power design.

Why Choose 5SGXEA4H2F35I2WN?

This Stratix V GX device is positioned for applications that require a large configurable logic fabric and significant embedded memory in an industrial-grade FPGA. Its combination of approximately 420,000 logic elements, approximately 38 Mbits of on-chip RAM, and 552 I/Os makes it suitable for consolidating complex digital subsystems onto a single programmable device.

Designed for developers and procurement teams needing high-density I/O and a compact FBGA package with clearly specified power and thermal limits, the 5SGXEA4H2F35I2WN offers a verifiable hardware profile and RoHS compliance for long-term project planning.

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