5SGXEA4H2F35I2LN

The 5SGXEA4H2F35I2LN is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑ball FBGA package intended for industrial applications. It delivers high logic density with a large embedded memory footprint and extensive I/O capability for complex, high-throughput designs.

Designed for use where high integration and programmability are required, this device targets advanced communications, signal processing, and compute-acceleration designs that benefit from a combination of abundant logic resources, on-chip memory, and multi‑hundred I/O count.

Key Features

• Logic Capacity — Approximately 420,000 logic elements (cells) to implement large-scale digital designs and custom compute pipelines.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support packet buffering, large FIFOs, or working datasets without external memory in many cases.
• I/O Density — 552 user I/O pins to accommodate wide parallel buses, multiple interfaces, and extensive peripheral connectivity.
• Transceiver Performance (Series) — Stratix V GX devices support high-speed transceiver channel rates (series documentation lists transceiver speeds up to 14.1 Gbps), enabling high-bandwidth serial links where required.
• Power — Low-voltage operation with a listed voltage supply range of 820 mV to 880 mV, suitable for low-core-voltage system architectures.
• Package & Mounting — 1152‑FBGA (35×35 mm) surface-mount package for compact board integration and reliable soldered mounting.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Telecommunications & Networking — High logic density and on-chip memory support packet processing, protocol offload, and line-rate traffic management for networking equipment.
• High‑Performance Signal Processing — Large logic and memory resources enable real-time DSP pipelines, FPGA-based accelerators, and multi‑channel signal conditioning.
• Data Center & Compute Acceleration — Use for hardware acceleration of compute kernels and custom offload engines that require significant parallel logic and memory resources.
• Industrial Automation & Instrumentation — Industrial temperature rating and abundant I/O make it suitable for complex control, data acquisition, and test-and-measurement systems.

Unique Advantages

• High Integration: Combines approximately 420,000 logic elements with ~37.9 Mbits of embedded memory to reduce reliance on external components and simplify system design.
• Wide I/O Flexibility: 552 I/O pins provide versatile connectivity options for parallel buses, multiple interfaces, and mixed-signal front-ends.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Compact, Surface‑Mount Package: 1152‑FBGA (35×35) package enables dense board layouts while maintaining robust soldered connections.
• Low‑Voltage Core: Core voltage supply in the 820 mV–880 mV range supports modern low-voltage system power domains.
• Standards‑Oriented Transceiver Capability: Stratix V GX series transceiver speeds (documented up to 14.1 Gbps) provide headroom for high-bandwidth serial links in communications designs.

Why Choose 5SGXEA4H2F35I2LN?

This Intel Stratix V GX device is positioned for designs that require significant programmable logic, substantial on-chip memory, and a high count of I/O in an industrial-temperature FPGA. Its combination of logic capacity, embedded RAM, and a high-density FBGA package makes it well suited to engineers building advanced communications, signal processing, and compute-accelerator systems.

Supported by Intel's Stratix V family datasheet and design ecosystem, the 5SGXEA4H2F35I2LN offers a scalable platform for development and deployment where performance, integration, and industrial operating range are priorities.

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